Exclusive deal : 20% Instant discount on Direct purchases! Don't wait—claim your discount today!
• The global Wafer Bumping market was valued at US$ 20140 Million in 2024
• It is estimated to expand at a CAGR of 9.10% % from 2024 to 2031
• The global Wafer Bumping market is expected to reach the value of US$ 36560 Million by the end of 2031
Wafer Bumping Market Overview
Wafer bumping technology can provide significant performance, form factor and cost advantages in a semiconductor package. Wafer bumping is an advanced manufacturing process whereby metal solder balls or bumps are formed on the semiconductor wafer prior to dicing. Wafer bumps provide an interconnection between the die and a substrate or printed circuit board in a device. Solder bump composition and dimension depends on a number of factors such as form factor, cost and the electrical, mechanical and thermal performance requirements of the semiconductor device.
The enterprise statistics in this article include IDM, IC Foundry and OSAT. Wafer bumps include gold bumps, tin bumps, copper pillar bumps, etc. There are certain differences in different types of downstream applications. For example, gold bumps are mainly used for display driver chips, which have high requirements for line accuracy, heat dissipation and other indicators, and gold bumps can meet such requirements. At the same time, gold bumps can increase current transmission efficiency and reduce resistance and thermal resistance. Different bumps also differ in size. For example, tin bumps are generally more solderable and 3-5 times larger than copper pillar bumps in size. At present, from the perspective of application scenarios, copper pillar bumps have a wide range of applications, including but not limited to general-purpose processors, image processors, memory chips, ASICs, FPGAs, power management chips, RF front-end chips, automotive electronics, etc. Wafer bumps are one of the representative technologies of advanced packaging. According to our internal statistics, the proportion of advanced packaging will exceed 50% in 2025. At the same time, with the continuous upgrading of downstream terminal demand, especially terminals represented by consumer electronics, which have higher requirements on power management stability, power consumption and chip size, chip packaging technology is gradually moving towards advanced packaging, such as WLCSP, SiP and 3D packaging.
This report studies and analyses global Wafer Bumping status and future trends, helping the client to determine the Wafer Bumping market size of the total market opportunity by Type, by Application, by company, and by region & country. This report is a detailed and comprehensive analysis of the world market for Wafer Bumping. It provides market size (in K Units & US$ million) and Year-over-Year growth, considering 2024 as the base year. For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments. To assess the competitive environment within the market, including supplier revenue, market share, and company profiles.
Wafer Bumping Market Key Takeaways
(1) Global Wafer Bumping market size, history data 2020-2024 , and forecast data 2024 -2031, (US$ million) & (K Units)
(2) Global Wafer Bumping sales, revenue, price by company, market share, and industry ranking 2020-2024, (US$ million) & (K Units)
(3) China Wafer Bumping sales, revenue, price by company, market share, and industry ranking 2020-2024, (US$ million) & (K Units)
(4) Global Wafer Bumping key consuming regions, consumption quantity, consumption value, and demand structure
(5) Global Wafer Bumping key producing regions, capacity, production, and year-over-year growth
(6) Wafer Bumping industry chains, upstream, midstream, and downstream
Wafer Bumping Market: Key Players
The competitive landscape of the Wafer Bumping Market offers a comprehensive analysis of key players. It includes insights such as company overviews, financial performance, revenue generation, market potential, research and development investments, new market strategies, regional presence, strengths and weaknesses, product launches, product range, and application leadership. These data points specifically pertain to the companies' activities and focus within the Wafer Bumping Market. Some of the major players operating in the Wafer Bumping Market are:
- Intel
- Samsung Semiconductor
- Amkor Technology
- ASE Global
- JCET Group
- Chipmore Technology
- ChipMOS TECHNOLOGIES
- NEPES
- Tianshui Huatian Technology
- Chipbond
- Union Semiconductor (Hefei)
- SMIC
- Raytek Semiconductor
- Jiangsu CAS Microelectronics Integration
- KYEC
- Shinko Electric Industries
- LB Semicon
- Tongfu Microelectronics
- UTAC
- Powertech Technology
- Faraday Technology Corporation
- Siliconware Precision Industries
- SFA Semicon
- Winstek Semiconductor
- Unisem Group
- SJ Semiconductor
- International Micro Industries
- ATX Group
Market IntelliX's study on the Wafer Bumping market offers information divided into important segments — type, applications, end-use, and region. This report provides comprehensive data and information about the important market dynamics and growth parameters associated with these categories.
Wafer Bumping Market by Type [Analysis by Value from 2020 to 2031]:
- IC Foundry
- IDM
- OSAT
Wafer Bumping Market by Application [Analysis by Value from 2020 to 2031]:
- 200mm Wafer
- 300mm Wafer
- Others
Wafer Bumping Market by Region [Analysis by Value from 2020 to 2031]:
- North America (United States, Canada and Mexico)
- Europe (Germany, UK, France, Italy, Russia and Spain etc.)
- Asia-Pacific (China, Japan, Korea, India, Australia and Southeast Asia etc.)
- South America (Brazil, Argentina and Colombia etc.)
- Middle East & Africa (South Africa, UAE and Saudi Arabia etc.)
Wafer Bumping Market Report Includes:
Chapter 1: To describe Wafer Bumping product scope, global sales quantity, value and average price, China sales quantity, value and average price, development opportunities, challenges, trends, and policies.
Chapter 2: Global Wafer Bumping market share and ranking of major manufacturers, sales quantity, revenue, average price, 2020-2024
Chapter 3: China Wafer Bumping market share and ranking of major manufacturers, sales quantity, revenue, average price, 2020-2024
Chapter 4: Global key producing regions of Wafer Bumping , percent & CAGR, 2020 - 2031
Chapter 5: Wafer Bumping industry chain, upstream, medium-stream, and downstream.
Chapter 6: Segment by Type, sales quantity, average price, consumption value, percent & CAGR, 2020 - 2031
Chapter 7: Segment by Application, sales quantity, average price, consumption value, percent & CAGR, 2020 - 2031
Chapter 8: Segment in regional level, sales quantity, average price, consumption value, percent & CAGR, 2020 - 2031
Chapter 9: Segment in country level, sales quantity, average price, consumption value, percent & CAGR, 2020 - 2031
Chapter 10: Company profile, introducing the basic situation of the main companies in the market in detail, including product specifications, application, recent development, sales quantity, average price, revenue, and gross margin.
Chapter 11: Conclusions
1 Market Overview
1.1 Wafer Bumping Definition
1.2 Global Wafer Bumping Market Size and Forecast
1.3 China Wafer Bumping Market Size and Forecast
1.4 Share of China Wafer Bumping Market with Respect to the Global Market
1.5 Wafer Bumping Market Size: China VS Global Growth Rate, 2020-2031
1.6 Wafer Bumping Market Dynamics
1.6.1 Wafer Bumping Market Drivers
1.6.2 Wafer Bumping Market Restraints
1.6.3 Wafer Bumping Industry Trends
1.6.4 Wafer Bumping Industry Policy
2 Global Leading Players and Market Share
2.1 By Revenue of Wafer Bumping, Global Market Share by Company, 2020-2025
2.2 Global Wafer Bumping Participants, Market Position (Tier 1, Tier 2, and Tier 3)
2.3 Global Wafer Bumping Concentration Ratio
2.4 Global Wafer Bumping Mergers & Acquisitions, Expansion Plans
2.5 Global Wafer Bumping Major Companies Product Type
2.6 Head Office and Area Served of Key Players
3 China Leading Players, Market Share and Ranking
3.1 By Revenue of Wafer Bumping, China Market Share by Company, 2020-2025
3.2 China Wafer Bumping Wafer Bumping Participants, Market Position (Tier 1, Tier 2, and Tier 3)
4 Industry Chain Analysis
4.1 Wafer Bumping Industry Chain
4.2 Wafer Bumping Upstream Analysis
4.2.1 Wafer Bumping Core Raw Materials
4.2.2 Main Manufacturers of Wafer Bumping Core Raw Materials
4.3 Midstream Analysis
4.4 Downstream Analysis
4.5 Wafer Bumping Production Mode
4.6 Wafer Bumping Procurement Model
4.7 Wafer Bumping Industry Sales Model and Sales Channels
4.7.1 Wafer Bumping Sales Model
4.7.2 Wafer Bumping Typical Distributors
5 Sights by Type
5.1 Wafer Bumping Classification
5.1.1 IC Foundry
5.1.2 IDM
5.1.3 OSAT
5.2 by Type, Global Wafer Bumping Consumption Value & CAGR, 2020 VS 2024 VS 2031
5.3 by Type, Global Wafer Bumping Consumption Value, 2020-2031
6 Sights by Application
6.1 Wafer Bumping Segment by Application
6.1.1 200mm Wafer
6.1.2 300mm Wafer
6.1.3 Others
6.2 by Application, Global Wafer Bumping Consumption Value & CAGR, 2020 VS 2024 VS 2031
6.3 by Application, Global Wafer Bumping Consumption Value, 2020-2031
7 Sales Sights by Region
7.1 By Region, Global Wafer Bumping Consumption Value, 2020 VS 2024 VS 2031
7.2 By Region, Global Wafer Bumping Consumption Value, 2020-2031
7.3 North America
7.3.1 North America Wafer Bumping Market Size & Forecasts, 2020-2031
7.3.2 By Country, North America Wafer Bumping Market Size Market Share
7.4 Europe
7.4.1 Europe Wafer Bumping Market Size & Forecasts, 2020-2031
7.4.2 By Country, Europe Wafer Bumping Market Size Market Share
7.5 Asia Pacific
7.5.1 Asia Pacific Wafer Bumping Market Size & Forecasts, 2020-2031
7.5.2 By Country/Region, Asia Pacific Wafer Bumping Market Size Market Share
7.6 South America
7.6.1 South AmericaWafer Bumping Market Size & Forecasts, 2020-2031
7.6.2 By Country, South America Wafer Bumping Market Size Market Share
7.7 Middle East & Africa
8 Sales Sights by Country Level
8.1 By Country, Global Wafer Bumping Market Size & CAGR, 2020 VS 2024 VS 2031
8.2 By Country, Global Wafer Bumping Consumption Value, 2020-2031
8.3 United States
8.3.1 United States Wafer Bumping Market Size, 2020-2031
8.3.2 by Type, United States Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.3.3 by Application, United States Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.4 Europe
8.4.1 Europe Wafer Bumping Market Size, 2020-2031
8.4.2 by Type, Europe Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.4.3 by Application, Europe Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.5 China
8.5.1 China Wafer Bumping Market Size, 2020-2031
8.5.2 by Type, China Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.5.3 by Application, China Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.6 Japan
8.6.1 Japan Wafer Bumping Market Size, 2020-2031
8.6.2 by Type, Japan Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.6.3 by Application, Japan Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.7 South Korea
8.7.1 South Korea Wafer Bumping Market Size, 2020-2031
8.7.2 by Type, South Korea Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.7.3 by Application, South Korea Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.8 Southeast Asia
8.8.1 Southeast Asia Wafer Bumping Market Size, 2020-2031
8.8.2 by Type, Southeast Asia Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.8.3 by Application, Southeast Asia Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.9 India
8.9.1 India Wafer Bumping Market Size, 2020-2031
8.9.2 by Type, India Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.9.3 by Application, India Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.10 Middle East & Africa
8.10.1 Middle East & Africa Wafer Bumping Market Size, 2020-2031
8.10.2 by Type, Middle East & Africa Wafer Bumping Consumption Value Market Share, 2024 VS 2031
8.10.3 by Application, Middle East & Africa Wafer Bumping Consumption Value Market Share, 2024 VS 2031
9 Company Profile
9.1 Intel
9.1.1 Intel Company Information, Head Office, Market Area, and Industry Position
9.1.2 Intel Company Profile and Main Business
9.1.3 Intel Wafer Bumping Models, Specifications, and Application
9.1.4 Intel Wafer Bumping Revenue and Gross Margin, 2020-2025
9.1.5 Intel Recent Developments
9.2 Samsung Semiconductor
9.2.1 Samsung Semiconductor Company Information, Head Office, Market Area, and Industry Position
9.2.2 Samsung Semiconductor Company Profile and Main Business
9.2.3 Samsung Semiconductor Wafer Bumping Models, Specifications, and Application
9.2.4 Samsung Semiconductor Wafer Bumping Revenue and Gross Margin, 2020-2025
9.2.5 Samsung Semiconductor Recent Developments
9.3 Amkor Technology
9.3.1 Amkor Technology Company Information, Head Office, Market Area, and Industry Position
9.3.2 Amkor Technology Company Profile and Main Business
9.3.3 Amkor Technology Wafer Bumping Models, Specifications, and Application
9.3.4 Amkor Technology Wafer Bumping Revenue and Gross Margin, 2020-2025
9.3.5 Amkor Technology Recent Developments
9.4 ASE Global
9.4.1 ASE Global Company Information, Head Office, Market Area, and Industry Position
9.4.2 ASE Global Company Profile and Main Business
9.4.3 ASE Global Wafer Bumping Models, Specifications, and Application
9.4.4 ASE Global Wafer Bumping Revenue and Gross Margin, 2020-2025
9.4.5 ASE Global Recent Developments
9.5 JCET Group
9.5.1 JCET Group Company Information, Head Office, Market Area, and Industry Position
9.5.2 JCET Group Company Profile and Main Business
9.5.3 JCET Group Wafer Bumping Models, Specifications, and Application
9.5.4 JCET Group Wafer Bumping Revenue and Gross Margin, 2020-2025
9.5.5 JCET Group Recent Developments
9.6 Chipmore Technology
9.6.1 Chipmore Technology Company Information, Head Office, Market Area, and Industry Position
9.6.2 Chipmore Technology Company Profile and Main Business
9.6.3 Chipmore Technology Wafer Bumping Models, Specifications, and Application
9.6.4 Chipmore Technology Wafer Bumping Revenue and Gross Margin, 2020-2025
9.6.5 Chipmore Technology Recent Developments
9.7 ChipMOS TECHNOLOGIES
9.7.1 ChipMOS TECHNOLOGIES Company Information, Head Office, Market Area, and Industry Position
9.7.2 ChipMOS TECHNOLOGIES Company Profile and Main Business
9.7.3 ChipMOS TECHNOLOGIES Wafer Bumping Models, Specifications, and Application
9.7.4 ChipMOS TECHNOLOGIES Wafer Bumping Revenue and Gross Margin, 2020-2025
9.7.5 ChipMOS TECHNOLOGIES Recent Developments
9.8 NEPES
9.8.1 NEPES Company Information, Head Office, Market Area, and Industry Position
9.8.2 NEPES Company Profile and Main Business
9.8.3 NEPES Wafer Bumping Models, Specifications, and Application
9.8.4 NEPES Wafer Bumping Revenue and Gross Margin, 2020-2025
9.8.5 NEPES Recent Developments
9.9 Tianshui Huatian Technology
9.9.1 Tianshui Huatian Technology Company Information, Head Office, Market Area, and Industry Position
9.9.2 Tianshui Huatian Technology Company Profile and Main Business
9.9.3 Tianshui Huatian Technology Wafer Bumping Models, Specifications, and Application
9.9.4 Tianshui Huatian Technology Wafer Bumping Revenue and Gross Margin, 2020-2025
9.9.5 Tianshui Huatian Technology Recent Developments
9.10 Chipbond
9.10.1 Chipbond Company Information, Head Office, Market Area, and Industry Position
9.10.2 Chipbond Company Profile and Main Business
9.10.3 Chipbond Wafer Bumping Models, Specifications, and Application
9.10.4 Chipbond Wafer Bumping Revenue and Gross Margin, 2020-2025
9.10.5 Chipbond Recent Developments
9.11 Union Semiconductor (Hefei)
9.11.1 Union Semiconductor (Hefei) Company Information, Head Office, Market Area, and Industry Position
9.11.2 Union Semiconductor (Hefei) Company Profile and Main Business
9.11.3 Union Semiconductor (Hefei) Wafer Bumping Models, Specifications, and Application
9.11.4 Union Semiconductor (Hefei) Wafer Bumping Revenue and Gross Margin, 2020-2025
9.11.5 Union Semiconductor (Hefei) Recent Developments
9.12 SMIC
9.12.1 SMIC Company Information, Head Office, Market Area, and Industry Position
9.12.2 SMIC Company Profile and Main Business
9.12.3 SMIC Wafer Bumping Models, Specifications, and Application
9.12.4 SMIC Wafer Bumping Revenue and Gross Margin, 2020-2025
9.12.5 SMIC Recent Developments
9.13 Raytek Semiconductor
9.13.1 Raytek Semiconductor Company Information, Head Office, Market Area, and Industry Position
9.13.2 Raytek Semiconductor Company Profile and Main Business
9.13.3 Raytek Semiconductor Wafer Bumping Models, Specifications, and Application
9.13.4 Raytek Semiconductor Wafer Bumping Revenue and Gross Margin, 2020-2025
9.13.5 Raytek Semiconductor Recent Developments
9.14 Jiangsu CAS Microelectronics Integration
9.14.1 Jiangsu CAS Microelectronics Integration Company Information, Head Office, Market Area, and Industry Position
9.14.2 Jiangsu CAS Microelectronics Integration Company Profile and Main Business
9.14.3 Jiangsu CAS Microelectronics Integration Wafer Bumping Models, Specifications, and Application
9.14.4 Jiangsu CAS Microelectronics Integration Wafer Bumping Revenue and Gross Margin, 2020-2025
9.14.5 Jiangsu CAS Microelectronics Integration Recent Developments
9.15 KYEC
9.15.1 KYEC Company Information, Head Office, Market Area, and Industry Position
9.15.2 KYEC Company Profile and Main Business
9.15.3 KYEC Wafer Bumping Models, Specifications, and Application
9.15.4 KYEC Wafer Bumping Revenue and Gross Margin, 2020-2025
9.15.5 KYEC Recent Developments
9.16 Shinko Electric Industries
9.16.1 Shinko Electric Industries Company Information, Head Office, Market Area, and Industry Position
9.16.2 Shinko Electric Industries Company Profile and Main Business
9.16.3 Shinko Electric Industries Wafer Bumping Models, Specifications, and Application
9.16.4 Shinko Electric Industries Wafer Bumping Revenue and Gross Margin, 2020-2025
9.16.5 Shinko Electric Industries Recent Developments
9.17 LB Semicon
9.17.1 LB Semicon Company Information, Head Office, Market Area, and Industry Position
9.17.2 LB Semicon Company Profile and Main Business
9.17.3 LB Semicon Wafer Bumping Models, Specifications, and Application
9.17.4 LB Semicon Wafer Bumping Revenue and Gross Margin, 2020-2025
9.17.5 LB Semicon Recent Developments
9.18 Tongfu Microelectronics
9.18.1 Tongfu Microelectronics Company Information, Head Office, Market Area, and Industry Position
9.18.2 Tongfu Microelectronics Company Profile and Main Business
9.18.3 Tongfu Microelectronics Wafer Bumping Models, Specifications, and Application
9.18.4 Tongfu Microelectronics Wafer Bumping Revenue and Gross Margin, 2020-2025
9.18.5 Tongfu Microelectronics Recent Developments
9.19 UTAC
9.19.1 UTAC Company Information, Head Office, Market Area, and Industry Position
9.19.2 UTAC Company Profile and Main Business
9.19.3 UTAC Wafer Bumping Models, Specifications, and Application
9.19.4 UTAC Wafer Bumping Revenue and Gross Margin, 2020-2025
9.19.5 UTAC Recent Developments
9.20 Powertech Technology
9.20.1 Powertech Technology Company Information, Head Office, Market Area, and Industry Position
9.20.2 Powertech Technology Company Profile and Main Business
9.20.3 Powertech Technology Wafer Bumping Models, Specifications, and Application
9.20.4 Powertech Technology Wafer Bumping Revenue and Gross Margin, 2020-2025
9.20.5 Powertech Technology Recent Developments
9.21 Faraday Technology Corporation
9.21.1 Faraday Technology Corporation Company Information, Head Office, Market Area, and Industry Position
9.21.2 Faraday Technology Corporation Company Profile and Main Business
9.21.3 Faraday Technology Corporation Wafer Bumping Models, Specifications, and Application
9.21.4 Faraday Technology Corporation Wafer Bumping Revenue and Gross Margin, 2020-2025
9.21.5 Faraday Technology Corporation Recent Developments
9.22 Siliconware Precision Industries
9.22.1 Siliconware Precision Industries Company Information, Head Office, Market Area, and Industry Position
9.22.2 Siliconware Precision Industries Company Profile and Main Business
9.22.3 Siliconware Precision Industries Wafer Bumping Models, Specifications, and Application
9.22.4 Siliconware Precision Industries Wafer Bumping Revenue and Gross Margin, 2020-2025
9.22.5 Siliconware Precision Industries Recent Developments
9.23 SFA Semicon
9.23.1 SFA Semicon Company Information, Head Office, Market Area, and Industry Position
9.23.2 SFA Semicon Company Profile and Main Business
9.23.3 SFA Semicon Wafer Bumping Models, Specifications, and Application
9.23.4 SFA Semicon Wafer Bumping Revenue and Gross Margin, 2020-2025
9.23.5 SFA Semicon Recent Developments
9.24 Winstek Semiconductor
9.24.1 Winstek Semiconductor Company Information, Head Office, Market Area, and Industry Position
9.24.2 Winstek Semiconductor Company Profile and Main Business
9.24.3 Winstek Semiconductor Wafer Bumping Models, Specifications, and Application
9.24.4 Winstek Semiconductor Wafer Bumping Revenue and Gross Margin, 2020-2025
9.24.5 Winstek Semiconductor Recent Developments
9.25 Unisem Group
9.25.1 Unisem Group Company Information, Head Office, Market Area, and Industry Position
9.25.2 Unisem Group Company Profile and Main Business
9.25.3 Unisem Group Wafer Bumping Models, Specifications, and Application
9.25.4 Unisem Group Wafer Bumping Revenue and Gross Margin, 2020-2025
9.25.5 Unisem Group Recent Developments
9.26 SJ Semiconductor
9.26.1 SJ Semiconductor Company Information, Head Office, Market Area, and Industry Position
9.26.2 SJ Semiconductor Company Profile and Main Business
9.26.3 SJ Semiconductor Wafer Bumping Models, Specifications, and Application
9.26.4 SJ Semiconductor Wafer Bumping Revenue and Gross Margin, 2020-2025
9.26.5 SJ Semiconductor Recent Developments
9.27 International Micro Industries
9.27.1 International Micro Industries Company Information, Head Office, Market Area, and Industry Position
9.27.2 International Micro Industries Company Profile and Main Business
9.27.3 International Micro Industries Wafer Bumping Models, Specifications, and Application
9.27.4 International Micro Industries Wafer Bumping Revenue and Gross Margin, 2020-2025
9.27.5 International Micro Industries Recent Developments
9.28 ATX Group
9.28.1 ATX Group Company Information, Head Office, Market Area, and Industry Position
9.28.2 ATX Group Company Profile and Main Business
9.28.3 ATX Group Wafer Bumping Models, Specifications, and Application
9.28.4 ATX Group Wafer Bumping Revenue and Gross Margin, 2020-2025
9.28.5 ATX Group Recent Developments
10 Conclusion
11 Appendix
11.1 Research Methodology
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Market Estimation Model
11.4 Disclaimer
Tables & Figures:
List of Tables
Table 1. Wafer Bumping Consumption Value & CAGR: China VS Global, 2020-2031, US$ Million
Table 2. Wafer Bumping Market Restraints
Table 3. Wafer Bumping Market Trends
Table 4. Wafer Bumping Industry Policy
Table 5. Global Wafer Bumping Revenue by Company, 2020-2025, US$ million, Ranked Based on Revenue in 2024
Table 6. Global Wafer Bumping Revenue Share by Company, 2020-2025, Ranked by Data of 2024
Table 7. Global Wafer Bumping Manufacturers Market Concentration Ratio (CR3 and HHI)
Table 8. Global Wafer Bumping Mergers & Acquisitions, Expansion Plans
Table 9. Global Wafer Bumping Major Companies Product Type
Table 10. Head Office and Area Served of Key Players
Table 11. China Wafer Bumping Revenue by Company, 2020-2025, US$ million, Ranked Based on Revenue in 2024
Table 12. China Wafer Bumping Revenue Market Share by Company, 2020-2025
Table 13. Global Key Players of Wafer Bumping Upstream (Raw Materials)
Table 14. Global Wafer Bumping Typical Customers
Table 15. Wafer Bumping Typical Distributors
Table 16. by Type, Global Wafer Bumping Consumption Value & CAGR, 2020 VS 2024 VS 2031, US$ Million
Table 17. by Application, Global Wafer Bumping Consumption Value & CAGR, 2020 VS 2024 VS 2031, US$ Million
Table 18. By Region, Global Wafer Bumping Consumption Value, 2020 VS 2024 VS 2031, US$ Million
Table 19. By Region, Global Wafer Bumping Consumption Value, 2020-2031, US$ Million
Table 20. By Country, Global Wafer Bumping Consumption Value & CAGR, 2020 VS 2024 VS 2031, US$ Million
Table 21. By Country, Global Wafer Bumping Consumption Value, 2020-2031, US$ Million
Table 22. By Country, Global Wafer Bumping Consumption Value Market Share, 2020-2031
Table 23. Intel Company Information, Head Office, Market Area, and Industry Position
Table 24. Intel Company Profile and Main Business
Table 25. Intel Wafer Bumping Models, Specifications, and Application
Table 26. Intel Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 27. Intel Recent Developments
Table 28. Samsung Semiconductor Company Information, Head Office, Market Area, and Industry Position
Table 29. Samsung Semiconductor Company Profile and Main Business
Table 30. Samsung Semiconductor Wafer Bumping Models, Specifications, and Application
Table 31. Samsung Semiconductor Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 32. Samsung Semiconductor Recent Developments
Table 33. Amkor Technology Company Information, Head Office, Market Area, and Industry Position
Table 34. Amkor Technology Company Profile and Main Business
Table 35. Amkor Technology Wafer Bumping Models, Specifications, and Application
Table 36. Amkor Technology Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 37. Amkor Technology Recent Developments
Table 38. ASE Global Company Information, Head Office, Market Area, and Industry Position
Table 39. ASE Global Company Profile and Main Business
Table 40. ASE Global Wafer Bumping Models, Specifications, and Application
Table 41. ASE Global Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 42. ASE Global Recent Developments
Table 43. JCET Group Company Information, Head Office, Market Area, and Industry Position
Table 44. JCET Group Company Profile and Main Business
Table 45. JCET Group Wafer Bumping Models, Specifications, and Application
Table 46. JCET Group Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 47. JCET Group Recent Developments
Table 48. Chipmore Technology Company Information, Head Office, Market Area, and Industry Position
Table 49. Chipmore Technology Company Profile and Main Business
Table 50. Chipmore Technology Wafer Bumping Models, Specifications, and Application
Table 51. Chipmore Technology Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 52. Chipmore Technology Recent Developments
Table 53. ChipMOS TECHNOLOGIES Company Information, Head Office, Market Area, and Industry Position
Table 54. ChipMOS TECHNOLOGIES Company Profile and Main Business
Table 55. ChipMOS TECHNOLOGIES Wafer Bumping Models, Specifications, and Application
Table 56. ChipMOS TECHNOLOGIES Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 57. ChipMOS TECHNOLOGIES Recent Developments
Table 58. NEPES Company Information, Head Office, Market Area, and Industry Position
Table 59. NEPES Company Profile and Main Business
Table 60. NEPES Wafer Bumping Models, Specifications, and Application
Table 61. NEPES Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 62. NEPES Recent Developments
Table 63. Tianshui Huatian Technology Company Information, Head Office, Market Area, and Industry Position
Table 64. Tianshui Huatian Technology Company Profile and Main Business
Table 65. Tianshui Huatian Technology Wafer Bumping Models, Specifications, and Application
Table 66. Tianshui Huatian Technology Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 67. Tianshui Huatian Technology Recent Developments
Table 68. Chipbond Company Information, Head Office, Market Area, and Industry Position
Table 69. Chipbond Company Profile and Main Business
Table 70. Chipbond Wafer Bumping Models, Specifications, and Application
Table 71. Chipbond Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 72. Chipbond Recent Developments
Table 73. Union Semiconductor (Hefei) Company Information, Head Office, Market Area, and Industry Position
Table 74. Union Semiconductor (Hefei) Company Profile and Main Business
Table 75. Union Semiconductor (Hefei) Wafer Bumping Models, Specifications, and Application
Table 76. Union Semiconductor (Hefei) Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 77. Union Semiconductor (Hefei) Recent Developments
Table 78. SMIC Company Information, Head Office, Market Area, and Industry Position
Table 79. SMIC Company Profile and Main Business
Table 80. SMIC Wafer Bumping Models, Specifications, and Application
Table 81. SMIC Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 82. SMIC Recent Developments
Table 83. Raytek Semiconductor Company Information, Head Office, Market Area, and Industry Position
Table 84. Raytek Semiconductor Company Profile and Main Business
Table 85. Raytek Semiconductor Wafer Bumping Models, Specifications, and Application
Table 86. Raytek Semiconductor Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 87. Raytek Semiconductor Recent Developments
Table 88. Jiangsu CAS Microelectronics Integration Company Information, Head Office, Market Area, and Industry Position
Table 89. Jiangsu CAS Microelectronics Integration Company Profile and Main Business
Table 90. Jiangsu CAS Microelectronics Integration Wafer Bumping Models, Specifications, and Application
Table 91. Jiangsu CAS Microelectronics Integration Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 92. Jiangsu CAS Microelectronics Integration Recent Developments
Table 93. KYEC Company Information, Head Office, Market Area, and Industry Position
Table 94. KYEC Company Profile and Main Business
Table 95. KYEC Wafer Bumping Models, Specifications, and Application
Table 96. KYEC Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 97. KYEC Recent Developments
Table 98. Shinko Electric Industries Company Information, Head Office, Market Area, and Industry Position
Table 99. Shinko Electric Industries Company Profile and Main Business
Table 100. Shinko Electric Industries Wafer Bumping Models, Specifications, and Application
Table 101. Shinko Electric Industries Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 102. Shinko Electric Industries Recent Developments
Table 103. LB Semicon Company Information, Head Office, Market Area, and Industry Position
Table 104. LB Semicon Company Profile and Main Business
Table 105. LB Semicon Wafer Bumping Models, Specifications, and Application
Table 106. LB Semicon Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 107. LB Semicon Recent Developments
Table 108. Tongfu Microelectronics Company Information, Head Office, Market Area, and Industry Position
Table 109. Tongfu Microelectronics Company Profile and Main Business
Table 110. Tongfu Microelectronics Wafer Bumping Models, Specifications, and Application
Table 111. Tongfu Microelectronics Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 112. Tongfu Microelectronics Recent Developments
Table 113. UTAC Company Information, Head Office, Market Area, and Industry Position
Table 114. UTAC Company Profile and Main Business
Table 115. UTAC Wafer Bumping Models, Specifications, and Application
Table 116. UTAC Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 117. UTAC Recent Developments
Table 118. Powertech Technology Company Information, Head Office, Market Area, and Industry Position
Table 119. Powertech Technology Company Profile and Main Business
Table 120. Powertech Technology Wafer Bumping Models, Specifications, and Application
Table 121. Powertech Technology Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 122. Powertech Technology Recent Developments
Table 123. Faraday Technology Corporation Company Information, Head Office, Market Area, and Industry Position
Table 124. Faraday Technology Corporation Company Profile and Main Business
Table 125. Faraday Technology Corporation Wafer Bumping Models, Specifications, and Application
Table 126. Faraday Technology Corporation Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 127. Faraday Technology Corporation Recent Developments
Table 128. Siliconware Precision Industries Company Information, Head Office, Market Area, and Industry Position
Table 129. Siliconware Precision Industries Company Profile and Main Business
Table 130. Siliconware Precision Industries Wafer Bumping Models, Specifications, and Application
Table 131. Siliconware Precision Industries Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 132. Siliconware Precision Industries Recent Developments
Table 133. SFA Semicon Company Information, Head Office, Market Area, and Industry Position
Table 134. SFA Semicon Company Profile and Main Business
Table 135. SFA Semicon Wafer Bumping Models, Specifications, and Application
Table 136. SFA Semicon Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 137. SFA Semicon Recent Developments
Table 138. Winstek Semiconductor Company Information, Head Office, Market Area, and Industry Position
Table 139. Winstek Semiconductor Company Profile and Main Business
Table 140. Winstek Semiconductor Wafer Bumping Models, Specifications, and Application
Table 141. Winstek Semiconductor Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 142. Winstek Semiconductor Recent Developments
Table 143. Unisem Group Company Information, Head Office, Market Area, and Industry Position
Table 144. Unisem Group Company Profile and Main Business
Table 145. Unisem Group Wafer Bumping Models, Specifications, and Application
Table 146. Unisem Group Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 147. Unisem Group Recent Developments
Table 148. SJ Semiconductor Company Information, Head Office, Market Area, and Industry Position
Table 149. SJ Semiconductor Company Profile and Main Business
Table 150. SJ Semiconductor Wafer Bumping Models, Specifications, and Application
Table 151. SJ Semiconductor Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 152. SJ Semiconductor Recent Developments
Table 153. International Micro Industries Company Information, Head Office, Market Area, and Industry Position
Table 154. International Micro Industries Company Profile and Main Business
Table 155. International Micro Industries Wafer Bumping Models, Specifications, and Application
Table 156. International Micro Industries Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 157. International Micro Industries Recent Developments
Table 158. ATX Group Company Information, Head Office, Market Area, and Industry Position
Table 159. ATX Group Company Profile and Main Business
Table 160. ATX Group Wafer Bumping Models, Specifications, and Application
Table 161. ATX Group Wafer Bumping Revenue and Gross Margin, US$ Million, 2020-2025
Table 162. ATX Group Recent Developments
List of Figures
Figure 1. Wafer Bumping Picture
Figure 2. Global Wafer Bumping Consumption Value, (US$ million) & (2020-2031)
Figure 3. China Wafer Bumping Consumption Value, (US$ million) & (2020-2031)
Figure 4. By Consumption Value, China Wafer Bumping Market Share of Global, 2020-2031
Figure 5. Global Wafer Bumping Market Share by Company, (Tier 1, Tier 2, and Tier 3), 2024
Figure 6. China Wafer Bumping Key Participants, Market Share, 2024
Figure 7. Wafer Bumping Industry Chain
Figure 8. Wafer Bumping Procurement Model
Figure 9. Wafer Bumping Sales Model
Figure 10. Wafer Bumping Sales Channels, Direct Sales, and Distribution
Figure 11. IC Foundry
Figure 12. IDM
Figure 13. OSAT
Figure 14. by Type, Global Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 15. by Type, Global Wafer Bumping Consumption Value Market Share, 2020-2031
Figure 16. 200mm Wafer
Figure 17. 300mm Wafer
Figure 18. Others
Figure 19. by Application, Global Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 20. by Application, Global Wafer Bumping Revenue Market Share, 2020-2031
Figure 21. By Region, Global Wafer Bumping Consumption Value Market Share, 2020-2031
Figure 22. North America Wafer Bumping Consumption Value & Forecasts, 2020-2031, US$ Million
Figure 23. By Country, North America Wafer Bumping Consumption Value Market Share, 2024
Figure 24. Europe Wafer Bumping Consumption Value & Forecasts, 2020-2031, US$ Million
Figure 25. By Country, Europe Wafer Bumping Consumption Value Market Share, 2024
Figure 26. Asia Pacific Wafer Bumping Consumption Value & Forecasts, 2020-2031, US$ Million
Figure 27. By Country/Region, Asia Pacific Wafer Bumping Consumption Value Market Share, 2024
Figure 28. South America Wafer Bumping Consumption Value & Forecasts, 2020-2031, US$ Million
Figure 29. By Country, South America Wafer Bumping Consumption Value Market Share, 2024
Figure 30. Middle East & Africa Wafer Bumping Consumption Value & Forecasts, 2020-2031, US$ Million
Figure 31. United States Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 32. by Type, United States Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 33. by Application, United States Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 34. Europe Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 35. by Type, Europe Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 36. by Application, Europe Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 37. China Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 38. by Type, China Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 39. by Application, China Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 40. Japan Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 41. by Type, Japan Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 42. by Application, Japan Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 43. South Korea Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 44. by Type, South Korea Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 45. by Application, South Korea Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 46. Southeast Asia Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 47. by Type, Southeast Asia Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 48. by Application, Southeast Asia Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 49. India Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 50. by Type, India Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 51. by Application, India Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 52. Middle East & Africa Wafer Bumping Consumption Value, 2020-2031, US$ Million
Figure 53. by Type, Middle East & Africa Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 54. by Application, Middle East & Africa Wafer Bumping Consumption Value Market Share, 2024 VS 2031
Figure 55. Research Methodology
Figure 56. Breakdown of Primary Interviews
Figure 57. Bottom-up Approaches
Figure 58. Top-down Approaches
Research Methodology:
Wafer Bumping Market Size Estimation
To estimate market size and trends, we use a combination of top-down and bottom-up methods. This allows us to evaluate the market from various perspectives—by company, region, product type, and end users.
Our estimates are based on actual sales data, excluding any discounts. Segment breakdowns and market shares are calculated using weighted averages based on usage rates and average prices. Regional insights are determined by how widely a product or service is adopted in each area.
Key companies are identified through secondary sources like industry reports and company filings. We then verify revenue estimates and other key data points through primary research, including interviews with industry experts, company executives, and decision-makers.
We take into account all relevant factors that could influence the market and validate our findings with real-world input. Our final insights combine both qualitative and quantitative data to provide a well-rounded view. Please note, these estimates do not account for unexpected changes such as inflation, economic downturns, or policy shifts.
Data Source
Secondary Sources
This study draws on a wide range of secondary sources, including press releases, annual reports, non-profit organizations, industry associations, government agencies, and customs data. We also referred to reputable databases and directories such as Bloomberg, Wind Info, Hoovers, Factiva, Trading Economics, Statista, and others. Additional references include investor presentations, company filings (e.g., SEC), economic data, and documents from regulatory and industry bodies.
These sources were used to gather technical and market-focused insights, identify key players, analyze market segmentation and classification, and track major trends and developments across industries.
Market Size |
|
|
Market Position of Top Company |
|
|
Qualitative Analysis |
|
|
Primary Sources
As part of our primary research, we interviewed a variety of stakeholders from both the supply and demand sides to gather valuable qualitative and quantitative insights.
On the supply side, we spoke with product manufacturers, competitors, industry experts, research institutions, distributors, traders, and raw material suppliers. On the demand side, we engaged with business leaders, marketing and sales heads, technology and innovation directors, supply chain executives, and end users across key organizations.
These conversations helped us better understand market segmentation, pricing, applications, leading players, supply chains, demand trends, industry outlook, and key market dynamics—including risks, opportunities, barriers, and strategic developments.
Key Data Information from Primary Sources
Primary Sources | Parameters | Key Data |
Market Segments(by Application, by Type) |
|
|
Total Market |
|
|