Global Semiconductor & IC Packaging Market Opportunities, Challenges, Strategies & Forecasts
This report studies the Semiconductor & IC Packaging market, covering market size for segment by type (Fan-Out Wafer-Level Packaging (FO WLP), Fan-In Wafer-Level Packaging (FI WLP), etc.), by application (Consumer Electronics, Telecommunications, etc.), by sales channel (Direct Channel, Distribution Channel), by player (TSMC, Advanced Semiconductor Engineering (ASE), JECT (formerly STATSChipPAC), Amkor (formerly Nanium), Deca Technologies, etc.) and by region (North America, Europe, Asia-Pacific, South America and Middle East & Africa).
This report provides detailed historical analysis of global market for Semiconductor & IC Packaging from 2016-2021, and provides extensive market forecasts from 2022-2030 by region/country and subsectors. It covers the sales/revenue/value, gross margin, historical growth and future perspectives in the Semiconductor & IC Packaging market.
Moreover, the impact of COVID-19 is also concerned. Since outbreak in December 2019, the COVID-19 virus has spread to all around the world and caused huge losses of lives and economy, and the global manufacturing, tourism and financial markets have been hit hard, while the online market/industry increase. Fortunately, with the development of vaccine and other effort by global governments and organizations, the negative impact of COVID-19 is expected to subside and the global economy is expected to recover.
This research covers COVID-19 impacts on the upstream, midstream and downstream industries. Moreover, this research provides an in-depth market evaluation by highlighting information on various aspects covering market dynamics like drivers, barriers, opportunities, threats, and industry news & trends. In the end, this report also provides in-depth analysis and professional advices on how to face the post COIVD-19 period.
The research methodology used to estimate and forecast this market begins by capturing the revenues of the key players and their shares in the market. Various secondary sources such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, have been used to identify and collect information useful for this extensive commercial study of the market. Calculations based on this led to the overall market size. After arriving at the overall market size, the total market has been split into several segments and subsegments, which have then been verified through primary research by conducting extensive interviews with industry experts such as CEOs, VPs, directors, and executives. The data triangulation and market breakdown procedures have been employed to complete the overall market engineering process and arrive at the exact statistics for all segments and subsegments.
Leading players of Semiconductor & IC Packaging including:
TSMC
Advanced Semiconductor Engineering (ASE)
JECT (formerly STATSChipPAC)
Amkor (formerly Nanium)
Deca Technologies
Nepes
SEMCO (out of FOPLP in 2019)
SPIL
Intel Corp
TFME
Huatian
Powertech Technology
UTAC
Walton Advanced Engineering
Kyocera
Chipbond
Chipmos
Market split by Type, can be divided into:
Fan-Out Wafer-Level Packaging (FO WLP)
Fan-In Wafer-Level Packaging (FI WLP)
Flip Chip (FC)
2.5D/3D
Others
Market split by Application, can be divided into:
Consumer Electronics
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Market split by Sales Channel, can be divided into:
Direct Channel
Distribution Channel
Market segment by Region/Country including:
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Spain etc.)
Asia-Pacific (China, Japan, Korea, India, Australia and Southeast Asia etc.)
South America (Brazil, Argentina and Colombia etc.)
Middle East & Africa (South Africa, UAE and Saudi Arabia etc.)
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Chapter 1 Semiconductor & IC Packaging Market Overview
1.1 Semiconductor & IC Packaging Definition
1.2 Global Semiconductor & IC Packaging Market Size Status and Outlook (2016-2030)
1.3 Global Semiconductor & IC Packaging Market Size Comparison by Region (2016-2030)
1.4 Global Semiconductor & IC Packaging Market Size Comparison by Type (2016-2030)
1.5 Global Semiconductor & IC Packaging Market Size Comparison by Application (2016-2030)
1.6 Global Semiconductor & IC Packaging Market Size Comparison by Sales Channel (2016-2030)
1.7 Semiconductor & IC Packaging Market Dynamics (COVID-19 Impacts)
1.7.1 Market Drivers/Opportunities
1.7.2 Market Challenges/Risks
1.7.3 Market News (Mergers/Acquisitions/Expansion)
1.7.4 COVID-19 Impacts
1.7.5 Post-Strategies of COVID-19
Chapter 2 Semiconductor & IC Packaging Market Segment Analysis by Player
2.1 Global Semiconductor & IC Packaging Sales and Market Share by Player (2019-2021)
2.2 Global Semiconductor & IC Packaging Revenue and Market Share by Player (2019-2021)
2.3 Global Semiconductor & IC Packaging Average Price by Player (2019-2021)
2.4 Players Competition Situation & Trends
2.5 Conclusion of Segment by Player
Chapter 3 Semiconductor & IC Packaging Market Segment Analysis by Type
3.1 Global Semiconductor & IC Packaging Market by Type
3.1.1 Fan-Out Wafer-Level Packaging (FO WLP)
3.1.2 Fan-In Wafer-Level Packaging (FI WLP)
3.1.3 Flip Chip (FC)
3.1.4 2.5D/3D
3.1.5 Others
3.2 Global Semiconductor & IC Packaging Sales and Market Share by Type (2016-2021)
3.3 Global Semiconductor & IC Packaging Revenue and Market Share by Type (2016-2021)
3.4 Global Semiconductor & IC Packaging Average Price by Type (2016-2021)
3.5 Leading Players of Semiconductor & IC Packaging by Type in 2021
3.6 Conclusion of Segment by Type
Chapter 4 Semiconductor & IC Packaging Market Segment Analysis by Application
4.1 Global Semiconductor & IC Packaging Market by Application
4.1.1 Consumer Electronics
4.1.2 Telecommunications
4.1.3 Automotive
4.1.4 Aerospace and Defense
4.1.5 Medical Devices
4.2 Global Semiconductor & IC Packaging Revenue and Market Share by Application (2016-2021)
4.3 Leading Consumers of Semiconductor & IC Packaging by Application in 2021
4.4 Conclusion of Segment by Application
Chapter 5 Semiconductor & IC Packaging Market Segment Analysis by Sales Channel
5.1 Global Semiconductor & IC Packaging Market by Sales Channel
5.1.1 Direct Channel
5.1.2 Distribution Channel
5.2 Global Semiconductor & IC Packaging Revenue and Market Share by Sales Channel (2016-2021)
5.3 Leading Distributors/Dealers of Semiconductor & IC Packaging by Sales Channel in 2021
5.4 Conclusion of Segment by Sales Channel
Chapter 6 Semiconductor & IC Packaging Market Segment Analysis by Region
6.1 Global Semiconductor & IC Packaging Market Size and CAGR by Region (2016-2030)
6.2 Global Semiconductor & IC Packaging Sales and Market Share by Region (2016-2021)
6.3 Global Semiconductor & IC Packaging Revenue and Market Share by Region (2016-2021)
6.4 North America
6.4.1 North America Market by Country
6.4.2 North America Semiconductor & IC Packaging Market Share by Type
6.4.3 North America Semiconductor & IC Packaging Market Share by Application
6.4.4 United States
6.4.5 Canada
6.4.6 Mexico
6.5 Europe
6.5.1 Europe Market by Country
6.5.2 Europe Semiconductor & IC Packaging Market Share by Type
6.5.3 Europe Semiconductor & IC Packaging Market Share by Application
6.5.4 Germany
6.5.5 UK
6.5.6 France
6.5.7 Italy
6.5.8 Russia
6.5.9 Spain
6.6 Asia-Pacific
6.6.1 Asia-Pacific Market by Country
6.6.2 Asia-Pacific Semiconductor & IC Packaging Market Share by Type
6.6.3 Asia-Pacific Semiconductor & IC Packaging Market Share by Application
6.6.4 China
6.6.5 Japan
6.6.6 Korea
6.6.7 India
6.6.8 Southeast Asia
6.6.9 Australia
6.7 South America
6.7.1 South America Market by Country
6.7.2 South America Semiconductor & IC Packaging Market Share by Type
6.7.3 South America Semiconductor & IC Packaging Market Share by Application
6.7.4 Brazil
6.7.5 Argentina
6.7.6 Colombia
6.8 Middle East & Africa
6.8.1 Middle East & Africa Market by Country
6.8.2 Middle East & Africa Semiconductor & IC Packaging Market Share by Type
6.8.3 Middle East & Africa Semiconductor & IC Packaging Market Share by Application
6.8.4 UAE
6.8.5 Saudi Arabia
6.8.6 South Africa
6.9 Conclusion of Segment by Region
Chapter 7 Profile of Leading Semiconductor & IC Packaging Players
7.1 TSMC
7.1.1 Company Snapshot
7.1.2 Product/Service Offered
7.1.3 Business Performance (Sales, Price, Revenue, Gross Margin and Market Share)
7.2 Advanced Semiconductor Engineering (ASE)
7.3 JECT (formerly STATSChipPAC)
7.4 Amkor (formerly Nanium)
7.5 Deca Technologies
7.6 Nepes
7.7 SEMCO (out of FOPLP in 2019)
7.8 SPIL
7.9 Intel Corp
7.10 TFME
7.11 Huatian
7.12 Powertech Technology
7.13 UTAC
7.14 Walton Advanced Engineering
7.15 Kyocera
7.16 Chipbond
7.17 Chipmos
Chapter 8 Upstream and Downstream Analysis of Semiconductor & IC Packaging
8.1 Industrial Chain of Semiconductor & IC Packaging
8.2 Upstream of Semiconductor & IC Packaging
8.3 Downstream of Semiconductor & IC Packaging
Chapter 9 Development Trend of Semiconductor & IC Packaging (2022-2030)
9.1 Global Semiconductor & IC Packaging Market Size (Sales and Revenue) Forecast (2022-2030)
9.2 Global Semiconductor & IC Packaging Market Size and CAGR Forecast by Region (2022-2030)
9.3 Global Semiconductor & IC Packaging Market Size and CAGR Forecast by Type (2022-2030)
9.4 Global Semiconductor & IC Packaging Market Size and CAGR Forecast by Application (2022-2030)
9.5 Global Semiconductor & IC Packaging Market Size and CAGR Forecast by Sales Channel (2022-2030)
Chapter 10 Appendix
10.1 Research Methodology
10.2 Data Sources
10.3 Disclaimer
10.4 Analysts Certification
Methodology/Research Approach
This research study involved the extensive usage of both primary and secondary data sources. The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. The following illustrative figure shows the market research methodology applied in this report.Research Programs/Design
| Historical Data (2015-2019) |
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Market Size Estimation
Top-down and bottom-up approaches are used to validate the global Voluntary Carbon Offset market size market and estimate the market size for Company, regions segments, product segments and Application (end users).
The market estimations in this report are based on the marketed sale price of Voluntary Carbon Offset (excluding any discounts provided by the player, distributor, wholesaler or traders). The percentage splits, market share, and breakdowns of the product segments are derived on the basis of weights assigned to each of the segments on the basis of their utilization rate and average sale price. The regional splits of the overall Voluntary Carbon Offset market and its sub-segments are based on the percentage adoption or utilization of the given product in the respective region or country.
Major Company in the market is identified through secondary research and their market revenues determined through primary and secondary research. Secondary research included the research of the annual and financial reports of the top Company; whereas, primary research included extensive interviews of key opinion leaders and industry experts such as experienced front-line staff, directors, CEOs and marketing executives. The percentage splits, market share, Growth Rate and breakdowns of the product markets are determined through using secondary sources and verified through the primary sources.
All possible factors that influence the markets included in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data. The market size for top-level markets and sub-segments is normalized, and the effect of inflation, economic downturns, and regulatory & policy changes or other factors are not accounted for in the market forecast. This data is combined and added with detailed inputs and analysis from Market Intellix and presented in this report
The following figure shows an illustrative representation of the overall market size estimation process used for this study.
Market Breakdown and Data Triangulation
After complete market engineering with calculations for market statistics; market size estimations; market forecasting; market breakdown; and data triangulation, extensive primary research was conducted to gather information and verify and validate the critical numbers arrived at. In the complete market engineering process, both top-down and bottom-up approaches were extensively used, along with several data triangulation methods, to perform market estimation and market forecasting for the overall market segments and sub-segments listed in this report. Extensive qualitative and further quantitative analysis is also done from all the numbers arrived at in the complete market engineering process to list key information throughout the report.
Data Source
Secondary Sources
Secondary sources include such as press releases, annual reports, non-profit organizations, industry associations, governmental agencies and customs data, etc. This research study involves the usage of widespread secondary sources, directories, databases such as Bloomberg Business, Wind Info, Hoovers, Factiva (Dow Jones & Company), and TRADING ECONOMICS, and News Network, statista, Federal Reserve Economic Data, annual reports, BIS Statistics, ICIS; company house documents; CAS(American Chemical Society); investor presentations; and SEC filings of companies. Secondary research was used to identify and collect information useful for the extensive, technical, market-oriented, and Hospitals study of the Voluntary Carbon Offset market. It was also used to obtain important information about the top companies, market classification and segmentation according to industry trends to the bottom-most level, and key developments related to market and technology perspectives.
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Primary Sources
In the primary research process, various sources from both the supply and demand sides were interviewed to obtain qualitative and quantitative information for this report. The primary sources from the supply side include product Company (and their competitors), opinion leaders, industry experts, research institutions, distributors, dealer and traders, as well as the raw materials suppliers and producers, etc.
The primary sources from the demand side include industry experts such as business leaders, marketing and sales directors, technology and innovation directors, supply chain executive, end use (product buyers), and related key executives from various key companies and organizations operating in the global market.
Primary research was conducted to identify segmentation Type, product price range, product Application, key Company, raw materials supply and the downstream demand, industry status and outlook, and key market dynamics such as risks, influence factors, opportunities, market barriers, industry trends, and key player strategies.
Key Executives Interviewed
Key Data Information from Primary Sources
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