Global Surface Mount Technology Electronics Packaging Market Report, History and Forecast 2018-2029, Breakdown Data by Companies, Key Regions, Types and Application
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This report aims to provide a comprehensive presentation of the global market for Surface Mount Technology Electronics Packaging, with and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Surface Mount Technology Electronics Packaging.
The Surface Mount Technology Electronics Packaging market size considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Surface Mount Technology Electronics Packaging market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Surface Mount Technology Electronics Packaging manufacturers, new entrants, and industry chain related companies in this market with information for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
The surface mount technology electronics packaging market which was growing at a value of 1.94 billion in 2021 and is expected to reach the value of USD 6.77 billion by 2029, at a CAGR of 16.90% during the forecast period of 2022-2029.
Competitive Landscape Analysis:
The main players in the Surface Mount Technology Electronics Packaging market include ASE Technology Holding Co., Ltd. (China), Amkor Technology (U.S.), JCET Global (China), Siliconware Precision Industries Co., Ltd. (China), and Powertech Technology Inc. (China). The share of the top 3 players in the Surface Mount Technology Electronics Packaging market is xx%.
REGION SHARE:
The report covers the market size information of North America, Europe, Asia Pacific, Latin America, Middle East and Africa, and North America accounted for xx%, Europe accounted for xx% of Surface Mount Technology Electronics Packaging market, and Asia Pacific accounted for xx%.
Segmental Analysis
The report segments the market by Type and Application. Plastic accounted for xx% of Surface Mount Technology Electronics Packaging market in 2022. Metal share of xx%.
Consumer Electronics accounted for xx% of the Surface Mount Technology Electronics Packaging market in 2022. Aerospace & Defense accounts for xx%.
The storage market is cold, and advanced technologies continue to develop.
With the rising inflation and weak demand in the terminal market, especially the decline in demand for PC and mobile phone terminal products affected by consumer spending, the growth expectation of the consumer storage market is lowered. In addition, the reduction of investment in data centers by technology giants such as Microsoft and Amazon will put downward pressure on the commercial storage market.
Although the consumer storage market will be cold, the market demand for applications such as automobiles is strong. With the substantial increase in sales of new energy vehicles, the amount of storage products required for bicycles will be greatly improved, especially after introducing other intelligent technologies such as ADAS and autonomous driving.
Different from the "uneven heat and cold" in various storage markets, major storage manufacturers have been trying and breaking through in the technical process. For example, in the field of DRAM, Micron's fifth-generation 10nm DRAM product (1β DRAM) has been sent to its partners for verification. Once the product is mature, it will be put into mobile phones, computers, servers, automobiles and other markets one after another.
In the field of NAND Flash, Micron's first 232-layer NAND product in the world has been mass-produced and is being supplied to PC OEM customers around the world; SK Hynix 238-layer 512Gb TLC 4D NAND flash memory is expected to be put into mass production in the first half of 2023. Samsung's plan is even bolder, claiming that it will realize 1,000 layers of V-NAND by 2030.
Segmental Analysis
North America
United States
Canada
Mexico
Europe
Germany
France
UK
Italy
Russia
Asia Pacific
China
Japan
South Korea
India
Southeast Asia
South America
Brazil
Argentina
Colombia
MEA
Saudi Arabia
Egypt
Nigeria
Some of the Top Market Players Covered Are:
ASE Technology Holding Co., Ltd. (China)
Amkor Technology (U.S.)
JCET Global (China)
Siliconware Precision Industries Co., Ltd. (China)
Powertech Technology Inc. (China)
TongFu Microelectronics Co.,Ltd. (China)
Lingsen Precision Industries, LTD. (China)
Sigurd Corporation (China)
OSE CORP. (China)
Tianshui Huatian Technology Co.,Ltd (China)
UTAC (Singapore)
King Yuan ELECTRONICS CO., LTD. (China)
ChipMOS TECHNOLOGIES INC. (China)
Formosa Advanced Technologies Co., Ltd. (Taiwan)
Market outlook by product/service type:
Plastic
Metal
Glass
Others
Market outlook by Application :
Consumer Electronics
Aerospace & Defense
Automotive
Telecommunication
Others
Table of Content
1 Surface Mount Technology Electronics Packaging Market Overview
1.1 Surface Mount Technology Electronics Packaging Product Description
1.2 Surface Mount Technology Electronics Packaging Market Segment by Type
1.3 Global Surface Mount Technology Electronics Packaging Market Size by Type
1.3.1 Global Surface Mount Technology Electronics Packaging Market Size Overview by Type
1.3.2 Global Surface Mount Technology Electronics Packaging Historic Market Size Review by Type
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Surface Mount Technology Electronics Packaging Sales Breakdown by Type
1.4.2 Europe Surface Mount Technology Electronics Packaging Sales Breakdown by Type
1.4.3 Asia-Pacific Surface Mount Technology Electronics Packaging Sales Breakdown by Type
1.4.4 Latin America Surface Mount Technology Electronics Packaging Sales Breakdown by Type
1.4.5 Middle East and Africa Surface Mount Technology Electronics Packaging Sales Breakdown by Type
2 Global Surface Mount Technology Electronics Packaging by Application
2.1 Surface Mount Technology Electronics Packaging Market Segment by Application
2.2 Global Surface Mount Technology Electronics Packaging Market Size by Application
2.2.1 Global Surface Mount Technology Electronics Packaging Market Size Overview by Application
2.2.2 Global Surface Mount Technology Electronics Packaging Historic Market Size Review by Application
2.3 Key Regions Market Size Segment by Application
2.3.1 North America Surface Mount Technology Electronics Packaging Sales Breakdown by Application
2.3.2 Europe Surface Mount Technology Electronics Packaging Sales Breakdown by Application
2.3.3 Asia-Pacific Surface Mount Technology Electronics Packaging Sales Breakdown by Application
2.3.4 Latin America Surface Mount Technology Electronics Packaging Sales Breakdown by Application
2.3.5 Middle East and Africa Surface Mount Technology Electronics Packaging Sales Breakdown by Application
3 Surface Mount Technology Electronics Packaging Status and Outlook by Region
3.1 Global Surface Mount Technology Electronics Packaging Market Size and CAGR by Region: 2018 VS 2023 VS 2029
3.2 Global Surface Mount Technology Electronics Packaging Historic Market Size by Region
3.2.1 Global Surface Mount Technology Electronics Packaging Sales in Volume by Region
3.2.2 Global Surface Mount Technology Electronics Packaging Sales in Value by Region
3.2.3 Global Surface Mount Technology Electronics Packaging Sales Price and Gross Margin
3.3 Global Surface Mount Technology Electronics Packaging Forecasted Market Size by Region
3.3.1 Global Surface Mount Technology Electronics Packaging Sales in Volume by Region
3.3.2 Global Surface Mount Technology Electronics Packaging Sales in Value by Region
3.3.3 Global Surface Mount Technology Electronics Packaging Sales Price and Gross Margin
4 Global Surface Mount Technology Electronics Packaging Market Competition by Company
4.1 Global Top Players by Surface Mount Technology Electronics Packaging Sales
4.2 Global Top Players by Surface Mount Technology Electronics Packaging Revenue
4.3 Global Top Players Surface Mount Technology Electronics Packaging Price
4.4 Global Top Manufacturers Surface Mount Technology Electronics Packaging Manufacturing Base Distribution, Sales Area, Product Type
4.5 Surface Mount Technology Electronics Packaging Market Competitive Situation and Trends
4.5.1 Surface Mount Technology Electronics Packaging Market Concentration Rate
4.5.2 Global 3 and 6 Largest Manufacturers by Surface Mount Technology Electronics Packaging Sales and Revenue in 2022
4.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Surface Mount Technology Electronics Packaging as of 2022)
4.7 Date of Key Manufacturers Enter into Surface Mount Technology Electronics Packaging Market
4.8 Key Manufacturers Surface Mount Technology Electronics Packaging Product Offered
4.9 Mergers & Acquisitions, Expansion
5 North America Surface Mount Technology Electronics Packaging by Country
5.1 North America Surface Mount Technology Electronics Packaging Historic Market Size by Country
5.1.1 North America Surface Mount Technology Electronics Packaging Sales in Volume by Country
5.1.2 North America Surface Mount Technology Electronics Packaging Sales in Value by Country
5.2 North America Surface Mount Technology Electronics Packaging Forecasted Market Size by Country
5.2.1 North America Surface Mount Technology Electronics Packaging Sales in Volume by Country
5.2.2 North America Surface Mount Technology Electronics Packaging Sales in Value by Country
6 Europe Surface Mount Technology Electronics Packaging by Country
6.1 Europe Surface Mount Technology Electronics Packaging Historic Market Size by Country
6.1.1 Europe Surface Mount Technology Electronics Packaging Sales in Volume by Country
6.1.2 Europe Surface Mount Technology Electronics Packaging Sales in Value by Country
6.2 Europe Surface Mount Technology Electronics Packaging Forecasted Market Size by Country
6.2.1 Europe Surface Mount Technology Electronics Packaging Sales in Volume by Country
6.2.2 Europe Surface Mount Technology Electronics Packaging Sales in Value by Country
7 Asia-Pacific Surface Mount Technology Electronics Packaging by Country
7.1 Asia-Pacific Surface Mount Technology Electronics Packaging Historic Market Size by Country
7.1.1 Asia-Pacific Surface Mount Technology Electronics Packaging Sales in Volume by Country
7.1.2 Asia-Pacific Surface Mount Technology Electronics Packaging Sales in Value by Country
7.2 Asia-Pacific Surface Mount Technology Electronics Packaging Forecasted Market Size by Country
7.2.1 Asia-Pacific Surface Mount Technology Electronics Packaging Sales in Volume by Country
7.2.2 Asia-Pacific Surface Mount Technology Electronics Packaging Sales in Value by Country
8 Latin America Surface Mount Technology Electronics Packaging by Country
8.1 Latin America Surface Mount Technology Electronics Packaging Historic Market Size by Country
8.1.1 Latin America Surface Mount Technology Electronics Packaging Sales in Volume by Country
8.1.2 Latin America Surface Mount Technology Electronics Packaging Sales in Value by Country
8.2 Latin America Surface Mount Technology Electronics Packaging Forecasted Market Size by Country
8.2.1 8.2.1 Latin America Surface Mount Technology Electronics Packaging Sales in Volume by Country
8.2.2 8.2.2 Latin America Surface Mount Technology Electronics Packaging Sales in Value by Country
9 Middle East and Africa Surface Mount Technology Electronics Packaging by Country
9.1 Middle East and Africa Surface Mount Technology Electronics Packaging Historic Market Size by Country
9.1.1 Middle East and Africa Surface Mount Technology Electronics Packaging Sales in Volume by Country
9.1.2 Middle East and Africa Surface Mount Technology Electronics Packaging Sales in Value by Country
9.2 Middle East and Africa Surface Mount Technology Electronics Packaging Forecasted Market Size by Country
9.2.1 Middle East and Africa Surface Mount Technology Electronics Packaging Sales in Volume by Country
9.2.2 Middle East and Africa Surface Mount Technology Electronics Packaging Sales in Value by Country
10 Manufacturers Profiles
10.1 ASE Technology Holding Co., Ltd. (China)
10.1.1 ASE Technology Holding Co., Ltd. (China) Information
10.1.2 Business Overview
10.1.3 ASE Technology Holding Co., Ltd. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.1.4 Surface Mount Technology Electronics Packaging Products Offered
10.1.5 ASE Technology Holding Co., Ltd. (China) Recent Development
10.2 Amkor Technology (U.S.)
10.2.1 Amkor Technology (U.S.) Information
10.2.2 Business Overview
10.2.3 Amkor Technology (U.S.) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.2.4 Surface Mount Technology Electronics Packaging Products Offered
10.2.5 Amkor Technology (U.S.) Recent Development
10.3 JCET Global (China)
10.3.1 JCET Global (China) Information
10.3.2 Business Overview
10.3.3 JCET Global (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.3.4 Surface Mount Technology Electronics Packaging Products Offered
10.3.5 JCET Global (China) Recent Development
10.4 Siliconware Precision Industries Co., Ltd. (China)
10.4.1 Siliconware Precision Industries Co., Ltd. (China) Information
10.4.2 Business Overview
10.4.3 Siliconware Precision Industries Co., Ltd. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.4.4 Surface Mount Technology Electronics Packaging Products Offered
10.4.5 Siliconware Precision Industries Co., Ltd. (China) Recent Development
10.5 Powertech Technology Inc. (China)
10.5.1 Powertech Technology Inc. (China) Information
10.5.2 Business Overview
10.5.3 Powertech Technology Inc. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.5.4 Surface Mount Technology Electronics Packaging Products Offered
10.5.5 Powertech Technology Inc. (China) Recent Development
10.6 TongFu Microelectronics Co.,Ltd. (China)
10.6.1 TongFu Microelectronics Co.,Ltd. (China) Information
10.6.2 Business Overview
10.6.3 TongFu Microelectronics Co.,Ltd. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.6.4 Surface Mount Technology Electronics Packaging Products Offered
10.6.5 TongFu Microelectronics Co.,Ltd. (China) Recent Development
10.7 Lingsen Precision Industries, LTD. (China)
10.7.1 Lingsen Precision Industries, LTD. (China) Information
10.7.2 Business Overview
10.7.3 Lingsen Precision Industries, LTD. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.7.4 Surface Mount Technology Electronics Packaging Products Offered
10.7.5 Lingsen Precision Industries, LTD. (China) Recent Development
10.8 Sigurd Corporation (China)
10.8.1 Sigurd Corporation (China) Information
10.8.2 Business Overview
10.8.3 Sigurd Corporation (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.8.4 Surface Mount Technology Electronics Packaging Products Offered
10.8.5 Sigurd Corporation (China) Recent Development
10.9 OSE CORP. (China)
10.9.1 OSE CORP. (China) Information
10.9.2 Business Overview
10.9.3 OSE CORP. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.9.4 Surface Mount Technology Electronics Packaging Products Offered
10.9.5 OSE CORP. (China) Recent Development
10.10 Tianshui Huatian Technology Co.,Ltd (China)
10.10.1 Tianshui Huatian Technology Co.,Ltd (China) Information
10.10.2 Business Overview
10.10.3 Tianshui Huatian Technology Co.,Ltd (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.10.4 Surface Mount Technology Electronics Packaging Products Offered
10.10.5 Tianshui Huatian Technology Co.,Ltd (China) Recent Development
10.11 UTAC (Singapore)
10.11.1 UTAC (Singapore) Information
10.11.2 Business Overview
10.11.3 UTAC (Singapore) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.11.4 Surface Mount Technology Electronics Packaging Products Offered
10.11.5 UTAC (Singapore) Recent Development
10.12 King Yuan ELECTRONICS CO., LTD. (China)
10.12.1 King Yuan ELECTRONICS CO., LTD. (China) Information
10.12.2 Business Overview
10.12.3 King Yuan ELECTRONICS CO., LTD. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.12.4 Surface Mount Technology Electronics Packaging Products Offered
10.12.5 King Yuan ELECTRONICS CO., LTD. (China) Recent Development
10.13 ChipMOS TECHNOLOGIES INC. (China)
10.13.1 ChipMOS TECHNOLOGIES INC. (China) Information
10.13.2 Business Overview
10.13.3 ChipMOS TECHNOLOGIES INC. (China) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.13.4 Surface Mount Technology Electronics Packaging Products Offered
10.13.5 ChipMOS TECHNOLOGIES INC. (China) Recent Development
10.14 Formosa Advanced Technologies Co., Ltd. (Taiwan)
10.14.1 Formosa Advanced Technologies Co., Ltd. (Taiwan) Information
10.14.2 Business Overview
10.14.3 Formosa Advanced Technologies Co., Ltd. (Taiwan) Surface Mount Technology Electronics Packaging Sales, Price, Revenue, Gross Margin
10.14.4 Surface Mount Technology Electronics Packaging Products Offered
10.14.5 Formosa Advanced Technologies Co., Ltd. (Taiwan) Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Surface Mount Technology Electronics Packaging Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Surface Mount Technology Electronics Packaging Industrial Chain Analysis
11.4 Surface Mount Technology Electronics Packaging Market Dynamics
11.4.1 Surface Mount Technology Electronics Packaging Industry Trends
11.4.2 Surface Mount Technology Electronics Packaging Growth Drivers
11.4.3 Surface Mount Technology Electronics Packaging Market Challenges
11.4.4 Surface Mount Technology Electronics Packaging Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Surface Mount Technology Electronics Packaging Distributors
12.3 Surface Mount Technology Electronics Packaging Downstream Customers
13 Research Findings and Conclusion
14 Methodology and Data Source
14.1 A Methodology
14.1.1 Research Process
14.1.2 Market Size Estimation
14.1.3 Market Breakdown and Data Triangulation
14.2 B Data Source
14.2.1 Legal Disclaimer
Research Methodology:
Global Surface Mount Technology Electronics Packaging Market Size Estimation
To estimate market size and trends, we use a combination of top-down and bottom-up methods. This allows us to evaluate the market from various perspectives—by company, region, product type, and end users.
Our estimates are based on actual sales data, excluding any discounts. Segment breakdowns and market shares are calculated using weighted averages based on usage rates and average prices. Regional insights are determined by how widely a product or service is adopted in each area.
Key companies are identified through secondary sources like industry reports and company filings. We then verify revenue estimates and other key data points through primary research, including interviews with industry experts, company executives, and decision-makers.
We take into account all relevant factors that could influence the market and validate our findings with real-world input. Our final insights combine both qualitative and quantitative data to provide a well-rounded view. Please note, these estimates do not account for unexpected changes such as inflation, economic downturns, or policy shifts.
Data Source
Secondary Sources
This study draws on a wide range of secondary sources, including press releases, annual reports, non-profit organizations, industry associations, government agencies, and customs data. We also referred to reputable databases and directories such as Bloomberg, Wind Info, Hoovers, Factiva, Trading Economics, Statista, and others. Additional references include investor presentations, company filings (e.g., SEC), economic data, and documents from regulatory and industry bodies.
These sources were used to gather technical and market-focused insights, identify key players, analyze market segmentation and classification, and track major trends and developments across industries.
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Primary Sources
As part of our primary research, we interviewed a variety of stakeholders from both the supply and demand sides to gather valuable qualitative and quantitative insights.
On the supply side, we spoke with product manufacturers, competitors, industry experts, research institutions, distributors, traders, and raw material suppliers. On the demand side, we engaged with business leaders, marketing and sales heads, technology and innovation directors, supply chain executives, and end users across key organizations.
These conversations helped us better understand market segmentation, pricing, applications, leading players, supply chains, demand trends, industry outlook, and key market dynamics—including risks, opportunities, barriers, and strategic developments.
Key Data Information from Primary Sources
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