Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Region: Trend Forecast and Growth Opportunity
Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Region: Trend Forecast and Growth Opportunity
The Substrate-Like PCB (SLP) Market report highlights technological advancements, investment opportunities, and regulatory frameworks shaping the industry landscape through 2030.
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Global substrate-like PCB (SLP) market will reach $5,983.6 million by 2031, growing by 14.9% annually over 2021-2031, driven by SLP’s ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization.
Highlighted with 78 tables and 69 figures, this 144-page report “Global Substrate-Like PCB (SLP) Market 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 μm, Less than 25/25 μm), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify global substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Region.
Based on Inspection Technology, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Automated Optical Inspection (AOI)
• Direct Imaging (DI)
• Automated Optical Shaping (AOS)
Based on Line/Space, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• 25/25 and 30/30 μm
• Less than 25/25 μm
By Application, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• Automotive Industry
• Medical Industry
• Industrial Use
• Computing and Communications
• Other Applications
Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Netherlands, Rest of Europe; Rest of Europe is further segmented into Russia, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (UAE，Saudi Arabia， South Africa and Rest of MEA)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of each national market by Inspection Technology, Line/Space and Application over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1 Introduction 8
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 22
2.2 Major Growth Drivers 24
2.3 Market Restraints and Challenges 28
2.4 Emerging Opportunities and Market Trends 31
2.5 Porter’s Fiver Forces Analysis 35
3 Segmentation of Global Market by Inspection Technology 39
3.1 Market Overview by Inspection Technology 39
3.2 Automated Optical Inspection (AOI) 41
3.3 Direct Imaging (DI) 42
4 Segmentation of Global Market by Line/Space 43
4.1 Market Overview by Line/Space 43
4.2 25/25 and 30/30 μm 45
4.3 Less than 25/25 μm 46
5 Segmentation of Global Market by Application 47
5.1 Market Overview by Application 47
5.2 Consumer Electronics 49
5.3 Automotive Industry 50
5.4 Medical Industry 51
5.5 Industrial Use 52
5.6 Computing and Communications 53
5.7 Other Applications 54
6 Segmentation of Global Market by Region 55
6.1 Geographic Market Overview 2021-2031 55
6.2 North America Market 2021-2031 by Country 59
6.2.1 Overview of North America Market 59
6.2.2 U.S. 63
6.2.3 Canada 66
6.2.4 Mexico 68
6.3 European Market 2021-2031 by Country 70
6.3.1 Overview of European Market 70
6.3.2 Germany 74
6.3.3 U.K. 76
6.3.4 France 78
6.3.5 Spain 80
6.3.6 Italy 82
6.3.7 Netherlands 84
6.3.8 Rest of European Market 86
6.4 Asia-Pacific Market 2021-2031 by Country 88
6.4.1 Overview of Asia-Pacific Market 88
6.4.2 Japan 92
6.4.3 China 95
6.4.4 Australia 97
6.4.5 India 99
6.4.6 South Korea 101
6.4.7 Rest of APAC Region 103
6.5 South America Market 2021-2031 by Country 105
6.5.1 Argentina 108
6.5.2 Brazil 110
6.5.3 Chile 112
6.5.4 Rest of South America Market 114
6.6 MEA Market 2021-2031 by Country 115
6.6.1 UAE 118
6.6.2 Saudi Arabia 120
6.6.3 South Africa 122
6.6.4 Other National Markets 124
7 Competitive Landscape 125
7.1 Overview of Key Vendors 125
7.2 New Product Launch, Partnership, Investment, and M&A 128
7.3 Company Profiles 129
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) 129
China Circuit Technology Corporation 131
Compaq Manufacturing Co., Ltd. 132
Daeduck Electronics Co., Ltd. 133
HannStar Board Corporation 134
Ibiden Co., Ltd. 135
Kinsus Interconnect Technology Corp 136
Korea Circuit Co., Ltd. 137
Samsung Electro-Mechanics Co., Ltd. 138
Shenzhen Fastprint Circuit Tech Co., Ltd. 139
Symtek Automation Asia Co., Ltd. 140
TTM Technologies, Inc. 141
Unimicron Technology Corp. 142
Zhen Ding Tech. Group Technology Holding Limited 143
RELATED REPORTS 144
Tables & Figures:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
Research Methodology:
Substrate-Like PCB (SLP) Market Size Estimation
To estimate market size and trends, we use a combination of top-down and bottom-up methods. This allows us to evaluate the market from various perspectives—by company, region, product type, and end users.
Our estimates are based on actual sales data, excluding any discounts. Segment breakdowns and market shares are calculated using weighted averages based on usage rates and average prices. Regional insights are determined by how widely a product or service is adopted in each area.
Key companies are identified through secondary sources like industry reports and company filings. We then verify revenue estimates and other key data points through primary research, including interviews with industry experts, company executives, and decision-makers.
We take into account all relevant factors that could influence the market and validate our findings with real-world input. Our final insights combine both qualitative and quantitative data to provide a well-rounded view. Please note, these estimates do not account for unexpected changes such as inflation, economic downturns, or policy shifts.
Data Source
Secondary Sources
This study draws on a wide range of secondary sources, including press releases, annual reports, non-profit organizations, industry associations, government agencies, and customs data. We also referred to reputable databases and directories such as Bloomberg, Wind Info, Hoovers, Factiva, Trading Economics, Statista, and others. Additional references include investor presentations, company filings (e.g., SEC), economic data, and documents from regulatory and industry bodies.
These sources were used to gather technical and market-focused insights, identify key players, analyze market segmentation and classification, and track major trends and developments across industries.
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Primary Sources
As part of our primary research, we interviewed a variety of stakeholders from both the supply and demand sides to gather valuable qualitative and quantitative insights.
On the supply side, we spoke with product manufacturers, competitors, industry experts, research institutions, distributors, traders, and raw material suppliers. On the demand side, we engaged with business leaders, marketing and sales heads, technology and innovation directors, supply chain executives, and end users across key organizations.
These conversations helped us better understand market segmentation, pricing, applications, leading players, supply chains, demand trends, industry outlook, and key market dynamics—including risks, opportunities, barriers, and strategic developments.
Key Data Information from Primary Sources
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