Global and China Chip Scale Electronics Packaging Industry Ecological Development and Analysis Report 2023
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The research time span covered by the report is from 2018 to 2029; it provides an overview of the Global Chip Scale Electronics Packaging Market and also provides a deeper in-depth segmentation of the market by regions, product type and downstream industries.
The chip scale electronics packaging market which was growing at a value of 28.49 billion in 2021 and is expected to reach the value of USD 102.81 billion by 2029, at a CAGR of 17.40% during the forecast period of 2022-2029.
Competitive Landscape Analysis:
The main players in the Chip Scale Electronics Packaging market include ASE Technology Holding Co., Ltd. (China), Amkor Technology (US), JCET Global (China), Siliconware Precision Industries Co., Ltd. (China), and Powertech Technology Inc. (China). The share of the top 3 players in the Chip Scale Electronics Packaging market is xx%.
REGION SHARE:
The report covers the market size information of North America, Europe, Asia Pacific, Latin America, Middle East and Africa, and North America accounted for xx%, Europe accounted for xx% of Chip Scale Electronics Packaging market, and Asia Pacific accounted for xx%.
Segmental Analysis
The report segments the market by Type and Application. Plastic accounted for xx% of Chip Scale Electronics Packaging market in 2022. Metal share of xx%.
Consumer Electronics accounted for xx% of the Chip Scale Electronics Packaging market in 2022. Aerospace & Defense accounts for xx%.
For competitive landscape, prominent players with considerable market shares are comprehensively analyzed in this report. With information regarding the concentration ratio and detailed data reflecting the market performance of each player shared, the readers can acquire a holistic view of the competitive situation and a better understanding of their competitors.
As the COVID-19 takes over the world, we are continuously tracking the changes in the markets. We analyzed the impact of the pandemic in detail, along with other key factors, such as macro-economy, regional conflicts, industry related news and policies. Meanwhile, market investment scenario, technology status and developments, supply chain challenges, among other essential research elements are all covered.
Key Factors Considered:
COVID-19
The report describes the market scenario during and post the pandemic in the vision of upstream, major market participants, downstream major customers, etc. Other aspects, such as changes in consumer behavior, demand, transport capacity, trade flow under COVID-19, have also been taken into consideration during the process of the research.
Regional Conflict / Russia-Ukraine War
The report also presents the impact of regional conflict on this market in an effort to aid the readers to understand how the market has been adversely influenced and how it's going to evolve in the years to come.
Challenges & Opportunities
Factors that may help create opportunities and boost profits for market players, as well as challenges that may restrain or even pose a threat to the development of the players, are revealed in the report, which can shed a light on strategic decisions and implementation.
The storage market is cold, and advanced technologies continue to develop.
With the rising inflation and weak demand in the terminal market, especially the decline in demand for PC and mobile phone terminal products affected by consumer spending, the growth expectation of the consumer storage market is lowered. In addition, the reduction of investment in data centers by technology giants such as Microsoft and Amazon will put downward pressure on the commercial storage market.
Although the consumer storage market will be cold, the market demand for applications such as automobiles is strong. With the substantial increase in sales of new energy vehicles, the amount of storage products required for bicycles will be greatly improved, especially after introducing other intelligent technologies such as ADAS and autonomous driving.
Different from the "uneven heat and cold" in various storage markets, major storage manufacturers have been trying and breaking through in the technical process. For example, in the field of DRAM, Micron's fifth-generation 10nm DRAM product (1β DRAM) has been sent to its partners for verification. Once the product is mature, it will be put into mobile phones, computers, servers, automobiles and other markets one after another.
In the field of NAND Flash, Micron's first 232-layer NAND product in the world has been mass-produced and is being supplied to PC OEM customers around the world; SK Hynix 238-layer 512Gb TLC 4D NAND flash memory is expected to be put into mass production in the first half of 2023. Samsung's plan is even bolder, claiming that it will realize 1,000 layers of V-NAND by 2030.
Segmental Analysis
North America
United States
Canada
China
Asia Pacific (Excluding China)
Japan
Korea
Southeast Asia
India
Australia
EMEA
Europe
Germany
France
UK
Italy
Russia
Nordic
Middle East
Africa
Latin America
Brazil
Argentina
Mexico
Some of the Top Market Players Covered Are:
ASE Technology Holding Co., Ltd. (China)
Amkor Technology (US)
JCET Global (China)
Siliconware Precision Industries Co., Ltd. (China)
Powertech Technology Inc. (China)
TongFu Microelectronics Co.,Ltd. (China)
Lingsen Precision Industries , LTD. (China)
Sigurd Corporation (China)
OSE CORP. (China)
Tianshui Huatian Technology Co.,Ltd (China)
UTAC. (Singapore)
King Yuan ELECTRONICS CO., LTD. (China)
ChipMOS TECHNOLOGIES INC. (China)
Formosa Advanced Technologies Co., Ltd. (Taiwan)
Market outlook by product/service type:
Plastic
Metal
Glass
Others
Market outlook by Application :
Consumer Electronics
Aerospace & Defense
Automotive
Telecommunication
Others
Table of Content
1 Chip Scale Electronics Packaging Market Introduction and Overview
1.1 Chip Scale Electronics Packaging Definition
1.2 Research Purposes
1.3 Currency Rate
1.4 Report Timeline
1.5 Economic Analysis of Global Regions
1.6 Inflation Analysis
1.7 The Impact of the Russian-Ukrainian War on the Market
2 Market Competition by Manufacturers
2.1 Global Chip Scale Electronics Packaging Sales and Market Share by Manufacturer
2.2 Global Chip Scale Electronics Packaging Revenue and Market Share by Manufacturer
2.3 Global Chip Scale Electronics Packaging Average Price by Manufacturers
2.4 Manufacturers Chip Scale Electronics Packaging Production Sites, Area Served, Product Types
2.5 Chip Scale Electronics Packaging Market Competitive Situation and Trends
2.5.1 Chip Scale Electronics Packaging Market Concentration Rate
2.5.2 Global Top 5 and Top 10 Players Market Share by Revenue in 2023
2.5.3 Mergers & Acquisitions, Expansion
3 Global Chip Scale Electronics Packaging Historical Market Analysis by Type
3.1 Market Size Analysis by Types
3.1.4 Global Chip Scale Electronics Packaging Market Share by Type 2018 VS 2022
3.2 Global Chip Scale Electronics Packaging Revenue and Market Share by Type
3.3 Global Chip Scale Electronics Packaging Sales and Market Share by Type
4 Global Chip Scale Electronics Packaging Historical and Forecast Market Analysis by Application
4.1 Market Size Analysis by Application
4.1.4 Global Chip Scale Electronics Packaging Market Share by Application 2018 VS 2022
4.2 Global Chip Scale Electronics Packaging Revenue Market Share by Application (2018-2023)
4.3 Global Chip Scale Electronics Packaging Sales Market Share by Application (2018-2023)
5 Global Market Growth Trends Analysis
5.1 Global Chip Scale Electronics Packaging Market Size (2018-2023)
5.2 Chip Scale Electronics Packaging Growth Trends Analysis by Regions
5.2.1 Chip Scale Electronics Packaging Market Size by Regions: 2018 VS 2023 VS 2029
5.2.2 Chip Scale Electronics Packaging Historic Revenue Market Size by Regions (2018-2023)
5.2.3 Chip Scale Electronics Packaging Historic Sales Market Size by Regions (2018-2023)
5.3 North America
5.3.1 North America Chip Scale Electronics Packaging Revenue by Countries (2018-2023)
5.3.2 North America Chip Scale Electronics Packaging Sales by Countries (2018-2023)
5.3.3 North America SWOT Analysis
5.3.4 United States
5.3.5 Canada
5.4 China
5.4.1 China SWOT Analysis
5.5 Asia Pacific (Excluding China)
5.5.1 Asia Pacific Chip Scale Electronics Packaging Revenue by Countries (2018-2023)
5.5.2 Asia Pacific Chip Scale Electronics Packaging Sales by Countries (2018-2023)
5.5.3 Asia Pacific SWOT Analysis
5.5.4 Japan
5.5.5 Korea
5.5.6 Southeast Asia
5.5.7 India
5.5.8 Australia
5.6 EMEA
5.6.1 EMEA Chip Scale Electronics Packaging Revenue by Countries (2018-2023)
5.6.2 EMEA Chip Scale Electronics Packaging Sales by Countries (2018-2023)
5.6.3 EMEA SWOT Analysis
5.6.4 Europe
5.6.5 Middle East
5.6.6 Africa
5.7 Latin America
5.7.1 Latin America Chip Scale Electronics Packaging Revenue by Countries (2018-2023)
5.7.2 Latin America Chip Scale Electronics Packaging Sales by Countries (2018-2023)
5.7.3 Latin America SWOT Analysis
5.7.4 Brazil
5.7.5 Argentina
5.7.6 Mexico
6 Players Profiles
6.1 ASE Technology Holding Co., Ltd. (China)
6.1.1 ASE Technology Holding Co., Ltd. (China) Company Profile
6.1.2 Chip Scale Electronics Packaging Product Overview
6.1.3 ASE Technology Holding Co., Ltd. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.1.4 ASE Technology Holding Co., Ltd. (China) Business Overview
6.1.5 SWOT Analysis
6.2 Amkor Technology (US)
6.2.1 Amkor Technology (US) Company Profile
6.2.2 Chip Scale Electronics Packaging Product Overview
6.2.3 Amkor Technology (US) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.2.4 Amkor Technology (US) Business Overview
6.2.5 SWOT Analysis
6.3 JCET Global (China)
6.3.1 JCET Global (China) Company Profile
6.3.2 Chip Scale Electronics Packaging Product Overview
6.3.3 JCET Global (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.3.4 JCET Global (China) Business Overview
6.3.5 SWOT Analysis
6.4 Siliconware Precision Industries Co., Ltd. (China)
6.4.1 Siliconware Precision Industries Co., Ltd. (China) Company Profile
6.4.2 Chip Scale Electronics Packaging Product Overview
6.4.3 Siliconware Precision Industries Co., Ltd. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.4.4 Siliconware Precision Industries Co., Ltd. (China) Business Overview
6.4.5 SWOT Analysis
6.5 Powertech Technology Inc. (China)
6.5.1 Powertech Technology Inc. (China) Company Profile
6.5.2 Chip Scale Electronics Packaging Product Overview
6.5.3 Powertech Technology Inc. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.5.4 Powertech Technology Inc. (China) Business Overview
6.5.5 SWOT Analysis
6.6 TongFu Microelectronics Co.,Ltd. (China)
6.6.1 TongFu Microelectronics Co.,Ltd. (China) Company Profile
6.6.2 Chip Scale Electronics Packaging Product Overview
6.6.3 TongFu Microelectronics Co.,Ltd. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.6.4 TongFu Microelectronics Co.,Ltd. (China) Business Overview
6.6.5 SWOT Analysis
6.7 Lingsen Precision Industries , LTD. (China)
6.7.1 Lingsen Precision Industries , LTD. (China) Company Profile
6.7.2 Chip Scale Electronics Packaging Product Overview
6.7.3 Lingsen Precision Industries , LTD. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.7.4 Lingsen Precision Industries , LTD. (China) Business Overview
6.7.5 SWOT Analysis
6.8 Sigurd Corporation (China)
6.8.1 Sigurd Corporation (China) Company Profile
6.8.2 Chip Scale Electronics Packaging Product Overview
6.8.3 Sigurd Corporation (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.8.4 Sigurd Corporation (China) Business Overview
6.8.5 SWOT Analysis
6.9 OSE CORP. (China)
6.9.1 OSE CORP. (China) Company Profile
6.9.2 Chip Scale Electronics Packaging Product Overview
6.9.3 OSE CORP. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.9.4 OSE CORP. (China) Business Overview
6.9.5 SWOT Analysis
6.10 Tianshui Huatian Technology Co.,Ltd (China)
6.10.1 Tianshui Huatian Technology Co.,Ltd (China) Company Profile
6.10.2 Chip Scale Electronics Packaging Product Overview
6.10.3 Tianshui Huatian Technology Co.,Ltd (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.10.4 Tianshui Huatian Technology Co.,Ltd (China) Business Overview
6.10.5 SWOT Analysis
6.11 UTAC. (Singapore)
6.11.1 UTAC. (Singapore) Company Profile
6.11.2 Chip Scale Electronics Packaging Product Overview
6.11.3 UTAC. (Singapore) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.11.4 UTAC. (Singapore) Business Overview
6.11.5 SWOT Analysis
6.12 King Yuan ELECTRONICS CO., LTD. (China)
6.12.1 King Yuan ELECTRONICS CO., LTD. (China) Company Profile
6.12.2 Chip Scale Electronics Packaging Product Overview
6.12.3 King Yuan ELECTRONICS CO., LTD. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.12.4 King Yuan ELECTRONICS CO., LTD. (China) Business Overview
6.12.5 SWOT Analysis
6.13 ChipMOS TECHNOLOGIES INC. (China)
6.13.1 ChipMOS TECHNOLOGIES INC. (China) Company Profile
6.13.2 Chip Scale Electronics Packaging Product Overview
6.13.3 ChipMOS TECHNOLOGIES INC. (China) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.13.4 ChipMOS TECHNOLOGIES INC. (China) Business Overview
6.13.5 SWOT Analysis
6.14 Formosa Advanced Technologies Co., Ltd. (Taiwan)
6.14.1 Formosa Advanced Technologies Co., Ltd. (Taiwan) Company Profile
6.14.2 Chip Scale Electronics Packaging Product Overview
6.14.3 Formosa Advanced Technologies Co., Ltd. (Taiwan) Chip Scale Electronics Packaging Market Performance (2018-2023)
6.14.4 Formosa Advanced Technologies Co., Ltd. (Taiwan) Business Overview
6.14.5 SWOT Analysis
7 Chip Scale Electronics Packaging Manufacturing Cost Analysis
7.1 Chip Scale Electronics Packaging Key Raw Materials Analysis
7.1.1 Key Raw Materials
7.1.2 Price Trend of Key Raw Materials
7.1.3 Key Suppliers of Raw Materials
7.2 Proportion of Manufacturing Cost Structure
7.3 Manufacturing Process Analysis of Chip Scale Electronics Packaging
7.4 Chip Scale Electronics Packaging Industrial Chain Analysis
8 Market Channel, Distributors, Traders and Dealers
8.1 Market Channel Status
8.1.1 Direct Marketing
8.1.2 Indirect Marketing
8.2 Chip Scale Electronics Packaging Typical Distributors
8.3 Chip Scale Electronics Packaging Typical Customers
9 Chip Scale Electronics Packaging Industry Dynamic Analysis
9.1 Chip Scale Electronics Packaging Market Trends Analysis
9.2 Chip Scale Electronics Packaging Market Drivers Analysis
9.3 Chip Scale Electronics Packaging Market Challenges Analysis
9.4 Chip Scale Electronics Packaging Market Restraints Analysis
10 Global Chip Scale Electronics Packaging Forecast Market Analysis by Type & Application
10.1 Global Chip Scale Electronics Packaging Revenue Market Forecast by Type (2023-2029)
10.2 Global Chip Scale Electronics Packaging Sales Market Forecast by Type (2023-2029)
10.3 Chip Scale Electronics Packaging Revenue Market Forecast by Application (2023-2029)
10.4 Chip Scale Electronics Packaging Sales Market Forecast by Application (2023-2029)
11 Global Chip Scale Electronics Packaging Forecast Market Analysis by Region
11.1 Chip Scale Electronics Packaging Revenue Market Forecast by Region (2023-2029)
11.2 Chip Scale Electronics Packaging Sales Market Forecast by Region (2023-2029)
11.3 North America Chip Scale Electronics Packaging Forecast Market Analysis
11.4 EMEA Chip Scale Electronics Packaging Forecast Market Analysis
11.5 China Chip Scale Electronics Packaging Forecast Market Analysis
11.6 Asia-Pacific Chip Scale Electronics Packaging Forecast Market Analysis
11.7 Latin America Chip Scale Electronics Packaging Forecast Market Analysis
12 Research Findings and Conclusion
Research Methodology:
Global and China Chip Scale Electronics Packaging Market Size Estimation
To estimate market size and trends, we use a combination of top-down and bottom-up methods. This allows us to evaluate the market from various perspectives—by company, region, product type, and end users.
Our estimates are based on actual sales data, excluding any discounts. Segment breakdowns and market shares are calculated using weighted averages based on usage rates and average prices. Regional insights are determined by how widely a product or service is adopted in each area.
Key companies are identified through secondary sources like industry reports and company filings. We then verify revenue estimates and other key data points through primary research, including interviews with industry experts, company executives, and decision-makers.
We take into account all relevant factors that could influence the market and validate our findings with real-world input. Our final insights combine both qualitative and quantitative data to provide a well-rounded view. Please note, these estimates do not account for unexpected changes such as inflation, economic downturns, or policy shifts.
Data Source
Secondary Sources
This study draws on a wide range of secondary sources, including press releases, annual reports, non-profit organizations, industry associations, government agencies, and customs data. We also referred to reputable databases and directories such as Bloomberg, Wind Info, Hoovers, Factiva, Trading Economics, Statista, and others. Additional references include investor presentations, company filings (e.g., SEC), economic data, and documents from regulatory and industry bodies.
These sources were used to gather technical and market-focused insights, identify key players, analyze market segmentation and classification, and track major trends and developments across industries.
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Primary Sources
As part of our primary research, we interviewed a variety of stakeholders from both the supply and demand sides to gather valuable qualitative and quantitative insights.
On the supply side, we spoke with product manufacturers, competitors, industry experts, research institutions, distributors, traders, and raw material suppliers. On the demand side, we engaged with business leaders, marketing and sales heads, technology and innovation directors, supply chain executives, and end users across key organizations.
These conversations helped us better understand market segmentation, pricing, applications, leading players, supply chains, demand trends, industry outlook, and key market dynamics—including risks, opportunities, barriers, and strategic developments.
Key Data Information from Primary Sources
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