Global 2 5D and 3D IC Packaging Industry

Global 2.5D and 3D IC Packaging Industry Research & Trends Analysis Report

Global 2 5D and 3D IC Packaging Industry

Global 2.5D and 3D IC Packaging Industry Research & Trends Analysis Report


2.5D and 3D IC Packaging Market by End User (Office Building Construction, Retail Construction, Hospitality Construction, Institutional Construction, Other End Users), by North America (United States, Canada, Mexico), by South America (Brazil, Argentina, Rest of South America), by Europe (United Kingdom, Germany, France, Italy, Spain, Russia, Benelux, Nordics, Rest of Europe), by Middle East & Africa (Turkey, Israel, GCC, North Africa, South Africa, Rest of Middle East & Africa), by Asia Pacific (China, India, Japan, South Korea, ASEAN, Oceania, Rest of Asia Pacific) Forecast 2024- is a comprehensive report that provides insights into the market dynamics, including the key drivers, challenges, and opportunities shaping the industry landscape. It also delves into the competitive landscape, highlighting the major players and their strategies.


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According to Latest Study, the global market for 2.5D and 3D IC Packaging should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.

China 2.5D and 3D IC Packaging market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.

The United States 2.5D and 3D IC Packaging market should grow from US$ million in 2023 to US$ million by 2030, with a CAGR of % for the period of 2024-2030.

In terms of type, 2.5D segment holds a share about % in 2024 and will reach % in 2030; while in terms of application, Consumer Electronics has a share approximately % in 2023 and will grow at a CAGR % during 2024 and 2030.

The global key manufacturers of 2.5D and 3D IC Packaging include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC and SK Hynix, etc. In 2022, the global top five players hold a share approximately % in terms of revenue.

In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.

This report aims to provide a comprehensive study of the global market for 2.5D and 3D IC Packaging. Report Highlights:

(1) Global 2.5D and 3D IC Packaging market size (value), history data from 2019-2023 and forecast data from 2024 to 2030.

(2) Global 2.5D and 3D IC Packaging market competitive situation, revenue and market share, from 2019 to 2023.

(3) China 2.5D and 3D IC Packaging market competitive situation, revenue and market share, from 2019 to 2023.

(4) Global 2.5D and 3D IC Packaging segment by region (or country), key regions cover the United States, Europe, Japan, South Korea, Southeast Asia and India, etc.

(5) Global 2.5D and 3D IC Packaging segment by type and by application and regional segment by type and by application.

(6) 2.5D and 3D IC Packaging industry supply chain, upstream, midstream and downstream analysis.

Market segment by regions, regional analysis covers

North America (United States, Canada and Mexico)

Europe (Germany, France, UK, Russia, Italy and Rest of Europe)

Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Australia and Rest of Asia-Pacific)

South America (Brazil, Rest of South America)

Middle East & Africa

Market segment by type, covers

2.5D

3D TSV

3D Wafer-level Chip-scale Packaging

Market segment by application, can be divided into

Consumer Electronics

Medical Devices

Communications and Telecom

Automotive

Other

Market segment by players, this report covers

ASE Technology

Samsung Electronics

Toshiba

STMicroelectronics

Xilinx

Intel

Micron Technology

TSMC

SK Hynix

Amkor Technology

GlobalFoundries

SanDisk (Western Digital)

Synopsys

Invensas

Siliconware Precision Industries

Jiangsu Changjiang Electronics

Powertech Technology

1 Market Overview

1.1 Product Overview and Scope of 2.5D and 3D IC Packaging

1.2 Global 2.5D and 3D IC Packaging Market Size and Forecast

1.3 China 2.5D and 3D IC Packaging Market Size and Forecast

1.4 China Market Percentage in Global

1.4.1 By Revenue, China 2.5D and 3D IC Packaging Share in Global Market, 2019-2030

1.4.2 2.5D and 3D IC Packaging Market Size: China VS Global, 2019-2030

1.5 2.5D and 3D IC Packaging Market Dynamics

1.5.1 2.5D and 3D IC Packaging Market Drivers

1.5.2 2.5D and 3D IC Packaging Market Restraints

1.5.3 2.5D and 3D IC Packaging Industry Trends

1.5.4 2.5D and 3D IC Packaging Industry Policy

2 Global Competitive Situation by Company

2.1 Global 2.5D and 3D IC Packaging Revenue by Company (2019-2024)

2.2 Global 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2 and Tier 3)

2.3 Global 2.5D and 3D IC Packaging Concentration Ratio

2.4 Global 2.5D and 3D IC Packaging Mergers & Acquisitions, Expansion Plans

2.5 Global 2.5D and 3D IC Packaging Manufacturers Product Type

3 China Competitive Situation by Company

3.1 China 2.5D and 3D IC Packaging Revenue by Company (2019-2024)

3.2 China 2.5D and 3D IC Packaging 2.5D and 3D IC Packaging Participants, Market Position (Tier 1, Tier 2 and Tier 3)

3.3 China 2.5D and 3D IC Packaging, Revenue Percentage of Local Players VS Foreign Manufacturers (2019-2024)

4 Industry Chain Analysis

4.1 2.5D and 3D IC Packaging Industry Chain

4.2 2.5D and 3D IC Packaging Upstream Analysis

4.3 2.5D and 3D IC Packaging Midstream Analysis

4.4 2.5D and 3D IC Packaging Downstream Analysis

5 Sights by Type

5.1 2.5D and 3D IC Packaging Classification

5.1.1 2.5D

5.1.2 3D TSV

5.1.3 3D Wafer-level Chip-scale Packaging

5.2 By Type, Global 2.5D and 3D IC Packaging Market Size & CAGR, 2019 VS 2024 VS 2030

5.3 By Type, Global 2.5D and 3D IC Packaging Revenue, 2019-2030

6 Sights by Application

6.1 2.5D and 3D IC Packaging Segment by Application

6.1.1 Consumer Electronics

6.1.2 Medical Devices

6.1.3 Communications and Telecom

6.1.4 Automotive

6.1.5 Other

6.2 By Application, Global 2.5D and 3D IC Packaging Market Size & CAGR, 2019 VS 2024 VS 2030

6.3 By Application, Global 2.5D and 3D IC Packaging Revenue, 2019-2030

7 Sales Sights by Region

7.1 By Region, Global 2.5D and 3D IC Packaging Market Size, 2019 VS 2024 VS 2030

7.2 By Region, Global 2.5D and 3D IC Packaging Market Size, 2019-2030

7.3 North America

7.3.1 North America 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.3.2 By Country, North America 2.5D and 3D IC Packaging Market Size Market Share

7.4 Europe

7.4.1 Europe 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.4.2 By Country, Europe 2.5D and 3D IC Packaging Market Size Market Share

7.5 Asia Pacific

7.5.1 Asia Pacific 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.5.2 By Country/Region, Asia Pacific 2.5D and 3D IC Packaging Market Size Market Share

7.6 South America

7.6.1 South America 2.5D and 3D IC Packaging Market Size & Forecasts, 2019-2030

7.6.2 By Country, South America 2.5D and 3D IC Packaging Market Size Market Share

7.7 Middle East & Africa

8 Sights by Country Level

8.1 By Country, Global 2.5D and 3D IC Packaging Market Size & CAGR，2019 VS 2024 VS 2030

8.2 By Country, Global 2.5D and 3D IC Packaging Market Size, 2019-2030

8.3 U.S.

8.3.1 U.S. 2.5D and 3D IC Packaging Market Size, 2019-2030

8.3.2 By Company, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.3.3 By Type, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.3.4 By Application, U.S. 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.4 Europe

8.4.1 Europe 2.5D and 3D IC Packaging Market Size, 2019-2030

8.4.2 By Company, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.4.3 By Type, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.4.4 By Application, Europe 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.5 China

8.5.1 China 2.5D and 3D IC Packaging Market Size, 2019-2030

8.5.2 By Company, China 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.5.3 By Type, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.5.4 By Application, China 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.6 Japan

8.6.1 Japan 2.5D and 3D IC Packaging Market Size, 2019-2030

8.6.2 By Company, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.6.3 By Type, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.6.4 By Application, Japan 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.7 South Korea

8.7.1 South Korea 2.5D and 3D IC Packaging Market Size, 2019-2030

8.7.2 By Company, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.7.3 By Type, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.7.4 By Application, South Korea 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.8 Southeast Asia

8.8.1 Southeast Asia 2.5D and 3D IC Packaging Market Size, 2019-2030

8.8.2 By Company, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.8.3 By Type, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.8.4 By Application, Southeast Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.9 India

8.9.1 India 2.5D and 3D IC Packaging Market Size, 2019-2030

8.9.2 By Company, India 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.9.3 By Type, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.9.4 By Application, India 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.10 Middle East & Asia

8.10.1 Middle East & Asia 2.5D and 3D IC Packaging Market Size, 2019-2030

8.10.2 By Company, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2019-2024

8.10.3 By Type, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

8.10.4 By Application, Middle East & Asia 2.5D and 3D IC Packaging Revenue Market Share, 2022 VS 2029

9 Global Manufacturers Profile

9.1 ASE Technology

9.1.1 ASE Technology Company Information, Head Office, Market Area and Industry Position

9.1.2 ASE Technology Company Profile and Main Business

9.1.3 ASE Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.1.4 ASE Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.1.5 ASE Technology Recent Developments

9.2 Samsung Electronics

9.2.1 Samsung Electronics Company Information, Head Office, Market Area and Industry Position

9.2.2 Samsung Electronics Company Profile and Main Business

9.2.3 Samsung Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.2.4 Samsung Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.2.5 Samsung Electronics Recent Developments

9.3 Toshiba

9.3.1 Toshiba Company Information, Head Office, Market Area and Industry Position

9.3.2 Toshiba Company Profile and Main Business

9.3.3 Toshiba 2.5D and 3D IC Packaging Models, Specifications and Application

9.3.4 Toshiba 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.3.5 Toshiba Recent Developments

9.4 STMicroelectronics

9.4.1 STMicroelectronics Company Information, Head Office, Market Area and Industry Position

9.4.2 STMicroelectronics Company Profile and Main Business

9.4.3 STMicroelectronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.4.4 STMicroelectronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.4.5 STMicroelectronics Recent Developments

9.5 Xilinx

9.5.1 Xilinx Company Information, Head Office, Market Area and Industry Position

9.5.2 Xilinx Company Profile and Main Business

9.5.3 Xilinx 2.5D and 3D IC Packaging Models, Specifications and Application

9.5.4 Xilinx 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.5.5 Xilinx Recent Developments

9.6 Intel

9.6.1 Intel Company Information, Head Office, Market Area and Industry Position

9.6.2 Intel Company Profile and Main Business

9.6.3 Intel 2.5D and 3D IC Packaging Models, Specifications and Application

9.6.4 Intel 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.6.5 Intel Recent Developments

9.7 Micron Technology

9.7.1 Micron Technology Company Information, Head Office, Market Area and Industry Position

9.7.2 Micron Technology Company Profile and Main Business

9.7.3 Micron Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.7.4 Micron Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.7.5 Micron Technology Recent Developments

9.8 TSMC

9.8.1 TSMC Company Information, Head Office, Market Area and Industry Position

9.8.2 TSMC Company Profile and Main Business

9.8.3 TSMC 2.5D and 3D IC Packaging Models, Specifications and Application

9.8.4 TSMC 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.8.5 TSMC Recent Developments

9.9 SK Hynix

9.9.1 SK Hynix Company Information, Head Office, Market Area and Industry Position

9.9.2 SK Hynix Company Profile and Main Business

9.9.3 SK Hynix 2.5D and 3D IC Packaging Models, Specifications and Application

9.9.4 SK Hynix 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.9.5 SK Hynix Recent Developments

9.10 Amkor Technology

9.10.1 Amkor Technology Company Information, Head Office, Market Area and Industry Position

9.10.2 Amkor Technology Company Profile and Main Business

9.10.3 Amkor Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.10.4 Amkor Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.10.5 Amkor Technology Recent Developments

9.11 GlobalFoundries

9.11.1 GlobalFoundries Company Information, Head Office, Market Area and Industry Position

9.11.2 GlobalFoundries Company Profile and Main Business

9.11.3 GlobalFoundries 2.5D and 3D IC Packaging Models, Specifications and Application

9.11.4 GlobalFoundries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.11.5 GlobalFoundries Recent Developments

9.12 SanDisk (Western Digital)

9.12.1 SanDisk (Western Digital) Company Information, Head Office, Market Area and Industry Position

9.12.2 SanDisk (Western Digital) Company Profile and Main Business

9.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Models, Specifications and Application

9.12.4 SanDisk (Western Digital) 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.12.5 SanDisk (Western Digital) Recent Developments

9.13 Synopsys

9.13.1 Synopsys Company Information, Head Office, Market Area and Industry Position

9.13.2 Synopsys Company Profile and Main Business

9.13.3 Synopsys 2.5D and 3D IC Packaging Models, Specifications and Application

9.13.4 Synopsys 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.13.5 Synopsys Recent Developments

9.14 Invensas

9.14.1 Invensas Company Information, Head Office, Market Area and Industry Position

9.14.2 Invensas Company Profile and Main Business

9.14.3 Invensas 2.5D and 3D IC Packaging Models, Specifications and Application

9.14.4 Invensas 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.14.5 Invensas Recent Developments

9.15 Siliconware Precision Industries

9.15.1 Siliconware Precision Industries Company Information, Head Office, Market Area and Industry Position

9.15.2 Siliconware Precision Industries Company Profile and Main Business

9.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Models, Specifications and Application

9.15.4 Siliconware Precision Industries 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.15.5 Siliconware Precision Industries Recent Developments

9.16 Jiangsu Changjiang Electronics

9.16.1 Jiangsu Changjiang Electronics Company Information, Head Office, Market Area and Industry Position

9.16.2 Jiangsu Changjiang Electronics Company Profile and Main Business

9.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Models, Specifications and Application

9.16.4 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.16.5 Jiangsu Changjiang Electronics Recent Developments

9.17 Powertech Technology

9.17.1 Powertech Technology Company Information, Head Office, Market Area and Industry Position

9.17.2 Powertech Technology Company Profile and Main Business

9.17.3 Powertech Technology 2.5D and 3D IC Packaging Models, Specifications and Application

9.17.4 Powertech Technology 2.5D and 3D IC Packaging Revenue and Gross Margin, 2019-2024

9.17.5 Powertech Technology Recent Developments

10 Conclusion

11 Appendix

11.1 Research Methodology

11.2 Data Source

11.2.1 Secondary Sources

11.2.2 Primary Sources

11.3 Market Estimation Model

11.4 Disclaimer

Tables & Figures:
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Research Methodology:
This research study involved the extensive usage of both primary and secondary data sources. The research process involved the study of various factors affecting the industry, including the government policy, market environment, competitive landscape, historical data, present trends in the market, technological innovation, upcoming technologies and the technical progress in related industry, and market risks, opportunities, market barriers and challenges. The following illustrative figure shows the market research methodology applied in this report.
2.5D and 3D IC Packaging Market Size Estimation

To estimate market size and trends, we use a combination of top-down and bottom-up methods. This allows us to evaluate the market from various perspectives—by company, region, product type, and end users.

Our estimates are based on actual sales data, excluding any discounts. Segment breakdowns and market shares are calculated using weighted averages based on usage rates and average prices. Regional insights are determined by how widely a product or service is adopted in each area.

Key companies are identified through secondary sources like industry reports and company filings. We then verify revenue estimates and other key data points through primary research, including interviews with industry experts, company executives, and decision-makers.

We take into account all relevant factors that could influence the market and validate our findings with real-world input. Our final insights combine both qualitative and quantitative data to provide a well-rounded view. Please note, these estimates do not account for unexpected changes such as inflation, economic downturns, or policy shifts.

Data Source

Secondary Sources

This study draws on a wide range of secondary sources, including press releases, annual reports, non-profit organizations, industry associations, government agencies, and customs data. We also referred to reputable databases and directories such as Bloomberg, Wind Info, Hoovers, Factiva, Trading Economics, Statista, and others. Additional references include investor presentations, company filings (e.g., SEC), economic data, and documents from regulatory and industry bodies.

These sources were used to gather technical and market-focused insights, identify key players, analyze market segmentation and classification, and track major trends and developments across industries.

Market Size
  • Segmental value
  • Geographic Penetration
  • Product Adoption Rate for Different market
  • Journals, Websites, and Press Releases
  • Annual Reports and SEC Filings
  • Company Websites and Press Releases
  • Public and Paid Databases
  • Market Intellix Data Repository
Market Position of Top Company
  • Product Financials
  • Geographic value Mix
  • Total Company value
  • Business/Segmental value Mix
Qualitative Analysis
  • Influence Factors
  • Market Potential
  • Market Risks and Opportunities
  • Industry Trends
  • Geographical Features
  • Government Policies
  • Company Websites and Press Releases
  • Public and Paid Databases
  • Annual Reports
  • Industry Associations
  • Market Intellix Data Repository

Primary Sources

As part of our primary research, we interviewed a variety of stakeholders from both the supply and demand sides to gather valuable qualitative and quantitative insights.

On the supply side, we spoke with product manufacturers, competitors, industry experts, research institutions, distributors, traders, and raw material suppliers. On the demand side, we engaged with business leaders, marketing and sales heads, technology and innovation directors, supply chain executives, and end users across key organizations.

These conversations helped us better understand market segmentation, pricing, applications, leading players, supply chains, demand trends, industry outlook, and key market dynamics—including risks, opportunities, barriers, and strategic developments.

Key Data Information from Primary Sources

Primary Sources Parameters Key Data
Market Segments(by Application, by Type)
  • Value by Type
  • Status and Forecast
  • Value by Application
  • Value by Regions, Status and Forecast (2025-2031)
  • Value Market Share by Type
  • Value Growth Rate by Type
  • Value by Application
  • Percentage and Growth Rate by Application
  • Value Growth Rate and Market Share by Regions
  • Market Size Status and Forecast (2025-2031)
Total Market
  • Overall Size, Status and Forecast
  • Market Size Status and Forecast (2025-2031)
Frequently asked questions(FAQ's):
Why is the 2.5D and 3D IC Packaging Market trending toward high growth trajectories?
A dynamic process in the 2.5D and 3D IC Packaging Market is initiated by new entrants, including competitors from unrelated industries, in addition to the established players like TSMC, Intel, Samsung, ASE, Amkor, etc..
How are players chosen for the research coverage of the 2.5D and 3D IC Packaging Market study?
MI used a variety of industry standards such as NAICS, ICB, TRIC, and others to identify functional players in the industry, which they then shortlist and validate in an iterative process to finalize the most relevant players.
What important business segments are segregated by application types in the latest edition of the 2.5D and 3D IC Packaging Market?
The key business segments in the 2.5D and 3D IC Packaging Market are segregated by applications [AI Chips, High-Performance Computing, Automotive Electronics, IoT] and types [2.5D Stacked, 3D-IC, Hybrid Bonding, Fan-Out].
What is the size of the 2.5D and 3D IC Packaging Industry?
According to the report, the 2.5D and 3D IC Packaging Industry will grow to USD XXX Million by 2030, with a YY% CAGR.
Where does the 2.5D and 3D IC Packaging Industry stands in terms of scaling end-use implementations?
According to the 2.5D and 3D IC Packaging Market research paper, organizations are making more progress than their supply chain counterparts, including suppliers.
Who should consider the 2.5D and 3D IC Packaging Market study?
The 2.5D and 3D IC Packaging Industry stakeholders, executives, and experts, as well as individuals who need to develop consumer-friendly strategies and use technology to stay ahead of the competition.